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Fingerprint chip spraying method, fingerprint chip manufacturing method, fingerprint chip module manufacturing method and fingerprint chip module manufacturing equipment

A fingerprint chip and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, character and pattern recognition, instruments, etc., can solve problems such as inability to spray chips, and achieve the effect of eliminating manual typesetting, saving labor costs, and improving spraying efficiency.

Pending Publication Date: 2021-11-23
昆山丘钛生物识别科技有限公司
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Problems solved by technology

But this method can only spray the surface of the chip, not the side of the chip

Method used

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  • Fingerprint chip spraying method, fingerprint chip manufacturing method, fingerprint chip module manufacturing method and fingerprint chip module manufacturing equipment
  • Fingerprint chip spraying method, fingerprint chip manufacturing method, fingerprint chip module manufacturing method and fingerprint chip module manufacturing equipment
  • Fingerprint chip spraying method, fingerprint chip manufacturing method, fingerprint chip module manufacturing method and fingerprint chip module manufacturing equipment

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Embodiment Construction

[0047] In order to better understand the above technical solutions, the technical solutions of the embodiments of this specification will be described in detail below through the drawings and specific examples. It should be understood that the embodiments of this specification and the specific features in the embodiments are the technical solutions of the embodiments of this specification. It is a detailed description, rather than a limitation to the technical solutions of this specification. In the case of no conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0048] The embodiment of this specification provides a fingerprint chip spraying method, such as figure 1 As shown, it is a flow chart of a fingerprint chip spraying method provided by the embodiment of this specification. The method includes the following steps:

[0049] Step S11: Fixing the bottom surface of the chip packaging large board on ...

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Abstract

The embodiment of the invention discloses a fingerprint chip spraying method, a manufacturing method, a module manufacturing method and equipment, and the method comprises the steps: fixing the bottom surface of a chip packaging large board on a bearing surface of a bottom surface fixing structure, wherein the interior of the chip packaging large board to be provided with a plurality of fingerprint chips; cutting the chip packaging large board to obtain the plurality of fingerprint chips fixed on the surface of the bearing surface; and spraying the plurality of fingerprint chips fixed on the surface of the bearing surface. According to the scheme, the side face spraying effect of the fingerprint chip can be effectively guaranteed, manual typesetting and loading of the fingerprint chip in the spraying process are avoided, the labor cost is saved, and the spraying efficiency of the fingerprint chip is improved.

Description

technical field [0001] The embodiments of this specification relate to the field of chip fabrication, and in particular to a fingerprint chip spraying method, manufacturing method, module manufacturing method and equipment. Background technique [0002] With the continuous development of science and technology, the functions of electronic devices are becoming more and more abundant. Most electronic devices are equipped with fingerprint chips, which are used to identify users' fingerprints for screen unlocking, payment and other operations. [0003] At present, in the processing process of fingerprint chips, the spraying method of fingerprint chips is usually: spraying the chip packaging board, then cutting and grading the chip packaging board, and finally inspecting and packaging the cut chips. But this method can only spray the surface of the chip, not the side of the chip. Contents of the invention [0004] The embodiment of this specification provides a fingerprint chi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56G06K9/00
CPCH01L21/568H01L21/561
Inventor 吴文龙
Owner 昆山丘钛生物识别科技有限公司
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