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Structure and mechanism for electrically-connecting an external-conductor

A technology for external conductors and electrical connections, applied in the direction of connecting components, connections, fixed connections, etc.

Pending Publication Date: 2021-11-30
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is still an overhead associated with the welding process

Method used

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  • Structure and mechanism for electrically-connecting an external-conductor
  • Structure and mechanism for electrically-connecting an external-conductor
  • Structure and mechanism for electrically-connecting an external-conductor

Examples

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Embodiment Construction

[0036] To promote an understanding of the principles of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It should be understood that such alterations and further modifications in the illustrated system and such further applications of the principles of the disclosure presented herein are within the purview of ordinary persons skilled in the art to which this disclosure pertains, thereby not intending to limit the scope of the disclosure. Thought-of.

[0037] The foregoing general description and the following detailed description are illustrative of the disclosure, not restrictive thereof.

[0038] Reference throughout this specification to "an aspect," "another aspect," or similar language means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, appearances of...

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PUM

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Abstract

The present disclosure relates to a structure (200) for electrically-connecting an external conductor (202). The structure comprises a wiring-substrate (204) comprising a stack based arrangement of a plurality of layers, wherein said layers are defined as electrically conducting layers (206) and insulating layer (208). A rivet (210) is supported from the wiring substrate (204) and comprises an embedded portion within the wiring substrate (204). The embedded portion comprises: an upper section (210-1) extending through the stack of the plurality of layers, and, a bottom section (210-2) extending laterally with reference to the upper section. A portion protruding from wiring substrate (204) is provided for receiving an external-conductor (202) and for thereby electrically connecting with the wiring substrate (204).

Description

technical field [0001] This topic is concerned with power electronics and, in particular, the connection structures within them. Background technique [0002] External conductors such as bus bars or power transmission cables are known to interface with wiring substrates such as PCBs (ie printed circuit boards) for electrical connection with remote equipment. Bus bars transfer power from the PCB to distant devices and vice versa and connect accordingly with conductive tracks, pads within the wiring substrate. [0003] It is well known that external conductors such as bus bars are not directly connected or mounted on the PCB due to the enormous structure and weight. Existing mechanisms for achieving galvanic connection between the outer conductor and the PCB include the use of press-fit contacts or press-fit connectors, which provide an interface between the PCB and the outer conductor. [0004] Such connectors are electrically and mechanically connected to the PCB via throu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/32B21J15/02B21K1/62B23K20/12H05K3/00B29C65/64H01R12/51
CPCH05K2201/10401H05K1/0263H05K2201/10272H05K2201/10356H05K3/32H05K2201/10962H05K2201/10409H05K3/0044H01R12/515B21J15/027B23K20/1295B21K1/62H05K3/4015B23K2101/36H05K1/05
Inventor M.里希特O.巴茨
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD