Bearing device, wafer transfer device, cavity device and wafer processing equipment

A technology of carrying devices and bearings, which is applied in transportation and packaging, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve problems such as low efficiency and economy, high price, and large footprint

Pending Publication Date: 2021-12-07
ZHONGKE JINGYUAN ELECTRON LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the wafer processing equipment in this field, it is necessary to automatically feed and output wafers for continuous wafer processing and inspection. The arm acts as a wafer transfer mechanism and the entire device has a large footprint
In addition, the mechanical arm takes a long time to transfer the film, and the price of conventional transfer valves, vacuum robotic arms, and vacuum pumps is relatively high
As a result, larger space occupation, lower efficiency and economy
Also, the valves between different pressure environments, and the respective wafer transfer mechanisms for wafer transfer in different pressure environments are separately driven, which also leads to complex control design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bearing device, wafer transfer device, cavity device and wafer processing equipment
  • Bearing device, wafer transfer device, cavity device and wafer processing equipment
  • Bearing device, wafer transfer device, cavity device and wafer processing equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] The technical solutions of the present disclosure will be further explained in detail by means of embodiments in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals and letters designate the same or similar components. The following description of the embodiments of the present disclosure with reference to the accompanying drawings is intended to explain the general inventive concept of the present disclosure, and should not be construed as a limitation of the present disclosure.

[0048] The accompanying drawings are used to illustrate the content of the present disclosure. Dimensions and shapes of components in the drawings do not reflect true scale of components used for retractable carriers relative to a reference, wafer transfer devices, chamber devices for exchanging wafers between different pressure environments, and wafer handling equipment .

[0049] First, the working principle on which the present disclos...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a bearing device capable of stretching relative to a reference object, a wafer transfer device, a cavity device for exchanging wafers among different pressure environments, and wafer processing equipment. The bearing device comprises a base part; a movable platform which is arranged opposite to the base part; a mandril configured to extend through a bearing fixed to the base and to be coupled to the movable platform; and a driving part which is fixed relative to the reference object and is configured to push the ejector rod to move relative to the base part. The bearing device further comprises a corrugated pipe assembly arranged to surround the ejector rod; the corrugated pipe assembly comprises a first corrugated pipe arranged on the ejector rod in a sleeving mode; the ejector rod and the first corrugated pipe jointly define a first space, and the first space is communicated to the atmospheric environment through a gap between the ejector rod and the bearing.

Description

technical field [0001] The present disclosure relates to the field of semiconductor technology, and in particular to a carrier device capable of stretching relative to a reference object, a wafer transfer device, a cavity device for exchanging wafers between different pressure environments, and a wafer processing device . Background technique [0002] With the development of semiconductor technology and the advancement of process technology, increasingly refined processes rely on a vacuum and dust-free processing environment; then, in the semiconductor processing industry, due to efficiency and cost considerations, it is urgent to improve the use of dust-free processing environments Rate. However, in the wafer processing equipment in this field, it is necessary to automatically feed and output wafers for continuous wafer processing and inspection. The arm acts as the wafer transport mechanism and the entire device has a large footprint. Moreover, the transfer time of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67739H01L21/67742H01L21/67011H01L21/67184H01L21/68714H01L21/68742H01L21/68764H01L21/68785H01L21/67751H01L21/68707
Inventor蒋磊米涛
OwnerZHONGKE JINGYUAN ELECTRON LTD