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Wiring circuit board

A technology for wiring circuit substrates and grounding wires, which is applied in the field of wiring circuit substrates, can solve various problems and achieve the effect of efficient manufacturing

Pending Publication Date: 2021-12-21
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the deposition rate of electroless plating in the wiring circuit pattern and the deposition rate of electroless plating in the ground pattern are different depending on whether these patterns are electrically connected to the metal supporting substrate, and it is difficult to form a uniform electroless plating layer in the conductor layer.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0043] 1. Wiring circuit board

[0044] refer to figure 1 and figure 2 The wired circuit board 1 which is the first embodiment of the wired circuit board of the present invention will be described.

[0045] Such as figure 1 and figure 2 As shown, the wired circuit board 1 has a sheet shape having a thickness. The wired circuit board 1 has, for example, a rectangular shape in plan view. The wired circuit board 1 includes, for example, a flexible printed wiring board with a reinforcement layer having a metal support layer 2 as a reinforcement layer, a suspension board with circuit having a metal support layer 2 as a suspension (spring) layer, and the like.

[0046] Specifically, as figure 2 As shown, a wired circuit board 1 has a metal supporting layer 2 , an insulating base layer 3 as an example of an insulating layer, a seed film 6 , a conductor layer 4 , a first plating layer 7 , a cover insulating layer 5 , and a second plating layer 8 .

[0047] The metal support ...

no. 2 Embodiment approach ＞

[0108] Next, refer to Figure 6 , and a second embodiment of the wired circuit board of the present invention will be described. In addition, in 2nd Embodiment, the same code|symbol is attached|subjected to the same member as 1st Embodiment mentioned above, and the description is abbreviate|omitted.

[0109] In the first embodiment described above, if figure 2 As shown, the opening 18C communicates with the through-hole 30A, but the structure of the remaining portion of the ground wire is not limited thereto.

[0110] In the second embodiment, if Figure 6 and Figure 7 As shown, the ground wire stub portion 18 has a third stub portion 18D as an example of a conduction portion in addition to the first stub portion 18A and the second stub portion 18B.

[0111] The third residual portion 18D is disposed in the opening 18C, and fills the through hole 30A. Furthermore, the third remaining portion 18D is in contact with one surface in the thickness direction of the metal supp...

no. 3 Embodiment approach ＞

[0117] Next, refer to Figure 8 , and a third embodiment of the wired circuit board of the present invention will be described. In addition, in 3rd Embodiment, the same code|symbol is attached|subjected to the same member as 1st Embodiment mentioned above, and the description is abbreviate|omitted.

[0118] In the first embodiment described above, if figure 1 As shown, the remaining portion of the ground wire 18 is arranged on the opposite side to the connection wiring 17 with respect to the first terminal 15 , but the arrangement of the remaining portion of the ground wire is not limited to this. In particular, the remaining portion of the ground lead can be freely arranged without considering a reduction in the strength of the printed circuit board 1 , and therefore, can also be arranged in the inner portion of the printed circuit board 1 .

[0119] In the third embodiment, if Figure 8 As shown, the ground wire stub 18 is integrally formed with the connection wiring 17 ....

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PUM

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Abstract

This wiring circuit board 1 comprises: a metal support layer 2; a base insulating layer 3 disposed on one side in the thickness direction of the metallic support layer 2; and a conductor layer 4 disposed on one side in the thickness direction of the base insulating layer 3 and provided with first terminals 15 and ground lead remainder portions 18 electrically connected to the first terminal 15. The base insulating layer 3 is provided with through-holes 30A passing therethrough in the thickness direction. The ground lead remainder portions 18 comprise openings 18C extending so as to surround the respective through-holes 30A.

Description

technical field [0001] The present invention relates to a wired circuit board. Background technique [0002] Conventionally, there is known a wired circuit board comprising a metal supporting board, an insulating base layer disposed on the metal supporting board, and a conductive layer disposed on the insulating base layer. The conductive layer includes a wiring circuit pattern electrically connecting two terminals and a A ground pattern that electrically connects the terminal to the metal support substrate. [0003] In such a wired circuit board, an electroless plating layer may be formed on the surface of the conductor layer. However, the deposition rate of electroless plating in the wiring circuit pattern and the deposition rate of electroless plating in the ground pattern differ depending on whether these patterns are electrically connected to the metal supporting substrate, and it is difficult to form a uniform electroless plating layer in the conductor layer. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/22
CPCH05K3/22H05K3/181H05K1/115H05K3/4038H05K3/445H05K2201/09563H05K2203/0323H05K2203/072H05K1/05H05K1/111H05K3/40H05K2203/0723
Inventor 滝本显也柴田直树高仓隼人
Owner NITTO DENKO CORP
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