Lead frame and packaging body
A lead frame and package technology, used in semiconductor devices, electrical solid state devices, semiconductor/solid state device components, etc., can solve the problems of high short circuit risk, easy deformation of pin 2, and large wire bonding force, avoiding the The effect of short circuit risk
Pending Publication Date: 2021-12-24
DIODES SHANGHAI +2
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Problems solved by technology
[0004] exist figure 1 Packaged products shown in the figure 1 As shown in , since the arc of the metal lead 3 is flat, the highest point of the arc (ie figure 1 The maximum distance H between the metal lead 3 and the upper surface of the chip 2) is too close to the surface of the chip 2, so that the metal lead 3 is very easy to contact the edge of the chip 2, and has a very high risk of short circuit
Second, in figure 1 In the structure of the packaged product shown, since the pin 12 of the lead frame 1 is at the second welding point of the metal lead 3 (ie figure 1 The contact position between the metal lead 3 and the pin 12) will be etched on the lower surface, and the metal lead 3 is very thick, and the bonding force is relatively large, so as figure 1 As shown, the pin 2 is easily deformed because it is difficult to withstand the wire bonding force
Method used
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[0023] Hereinafter, the technology of the present application will be described in detail in combination with specific implementation manners. It should be understood that the following specific embodiments are only used to help those skilled in the art understand the present application, rather than limiting the present application.
[0024] Such as figure 2 As shown, in this embodiment, a lead frame 100 is provided first. Those skilled in the art can understand that the lead frame 100 includes a plurality of frame units 110 , and the plurality of frame units 110 are connected by an outer frame 120 to form a whole. Each of the frame units 110 is defined by a packaging line W, and a cutting line is formed between adjacent frame units 110 . That is to say, the area circled by the package wire W is the area of the frame unit 110 . exist figure 2 Four frame units 110 are schematically shown in FIG. 4 , and those skilled in the art can understand that the lead frame 100 ma...
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A lead frame comprises at least one base island and a plurality of pins, each pin is provided with a first end close to the base island, and each pin is configured in the mode that the surface of each pin protrudes out of the surface, where a chip is attached, of the base island at the first end. The lead frame does not deform due to wire bonding force, and the highest point of the arc of the formed thick metal lead is located outside the surface of the chip, so that the situation that the lead contacts the edge of the chip is avoided, and the risk of short circuit can be avoided.
Description
technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a packaging body and a packaging method. Background technique [0002] Packaged products are usually mounted on a lead frame and packaged with a plastic encapsulant. [0003] figure 1 Shown is a schematic structural view of a conventional packaging product in the art. Such as figure 1 As shown in the package product, a chip 2 is mounted on the base island 11 of the lead frame 1, and a metal lead (especially an aluminum wire) 3 is used to connect the chip 2 to the pins of the lead frame 1. 12 connections, and finally packaged with plastic compound 4. [0004] exist figure 1 Packaged products shown, such as figure 1 As shown in , since the arc of the metal lead 3 is flat, the highest point of the arc (ie figure 1 The maximum distance H between the metal lead 3 and the upper surface of the chip 2) is too close to the surface of the chip 2, so that the metal lead 3 is ve...
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IPC IPC(8): H01L23/495H01L23/31
CPCH01L23/49544H01L23/49541H01L23/49503H01L23/4951H01L23/3121H01L2224/97H01L2224/48472H01L2224/4809H01L2224/48247H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 阳小芮吴畏
Owner DIODES SHANGHAI