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Wafer test system and method

A technology of wafer testing and testing platform, which is applied in the direction of optical testing of flaws/defects, measuring devices, and material analysis through optical means, and can solve problems such as wafer-level testing that cannot modulate optical signals

Pending Publication Date: 2021-12-28
NINGBO ABAX SENSING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of this application is to provide a system and method for wafer testing in view of the deficiencies in the above-mentioned prior art, so as to solve the technical problem that the existing wafer testing system cannot realize wafer-level testing of modulated optical signals

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  • Wafer test system and method

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Embodiment Construction

[0025] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0026] Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art w...

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Abstract

The invention provides a wafer test system and method, and the system comprises a test platform, a light emission system, a light modulation system, a signal input system, and a light signal feedback control system. The signal input system is used for inputting a modulation signal to the test platform. Therefore, the wafer-level test of the modulated optical signal is realized.

Description

technical field [0001] This application relates to the field of testing technology, in particular to the field of wafer testing systems for TOF chips. Background technique [0002] Time of flight (TOF), the principle is to continuously send light pulses to the target, and then use the sensor to receive the light returned from the object, and obtain the target distance by detecting the flight (round-trip) time of the light pulse . [0003] Wafer test (Circuit Probe, CP) is a test after wafer manufacturing is completed, used to verify whether each die (DIE) on the wafer meets device characteristics and other design specifications (Specification), after wafer test , the unqualified die can be screened out to obtain the yield rate of the wafer. [0004] The main working principle of the wafer-level test of the CMOS image sensor is as follows: under two different lighting environments, bright and dark, provided by the LED backlight, through the soldering of the test needle card...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/95
CPCG01N21/9501
Inventor 雷述宇
Owner NINGBO ABAX SENSING ELECTRONICS TECH CO LTD