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Expandable heat sink

A radiator and heat pipe technology, applied in the field of expandable radiators, can solve problems such as shortened equipment life, equipment performance degradation, and data throughput delay.

Pending Publication Date: 2021-12-28
INTEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increased performance and / or functionality can result in increased thermal challenges for devices and systems
Insufficient cooling can lead to degraded device performance, reduced device life, and delayed data throughput

Method used

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  • Expandable heat sink
  • Expandable heat sink
  • Expandable heat sink

Examples

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Embodiment Construction

[0017] example embodiment

[0018] The following detailed description sets forth examples of apparatus, methods, and systems related to implementing a deployable heat sink. For convenience, for example, features such as structure(s), function(s), and / or property(s) are described with reference to an embodiment; the described feature(s) can be utilized The various embodiments may be implemented using any suitable one or more of the features.

[0019] In the following description, terms commonly employed by those skilled in the art will be used to describe various aspects of the illustrative implementations to convey the substance of the illustrative implementations to others skilled in the art. However, it will be apparent to those skilled in the art that the embodiments disclosed herein may be practiced with only some of the described aspects. For purposes of illustration, specific numbers, materials and configurations are set forth in order to provide a thorough understan...

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PUM

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Abstract

Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

Description

technical field [0001] The present disclosure relates generally to the field of computing and / or device cooling, and more specifically, to deployable heat sinks. Background technique [0002] Emerging trends in electronics are changing the expected performance and form factor of devices as devices and systems are expected to have increased performance and functionality while having a relatively thin form factor. However, increased performance and / or functionality can result in increased thermal challenges for devices and systems. Insufficient cooling can result in degraded device performance, shortened device life, and delayed data throughput. Contents of the invention [0003] A first embodiment of the present disclosure provides an expandable heat sink for an electronic device, the expandable heat sink includes: a flexible thermally conductive material; and an actuator, wherein the actuator causes the expandable heat sink to assume a A retracted configuration having a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20136G06F1/1616G06F1/1656G06F1/166G06F1/203G06F1/206H05K7/20172H05K7/20336
Inventor 古勤暐李明哲朱维明粘诗玮
Owner INTEL CORP