Direct cooling of a power converter by using a stamped plate
A technology for converters and cooling fluids, which is applied in the field of converters and can solve problems such as volume limitations and reduced output
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[0040] figure 1 An exploded perspective view showing the structure of the converter 10 according to the invention. Three semiconductor modules 11 are shown, each having a base 22 and a substrate 12 . Cooling fins 18 are formed on the base plate 12 . Three semiconductor modules 11 are mounted in a common receiving plate 14 , wherein receiving plate 14 has recesses 16 corresponding to the number of semiconductor modules 11 . The cutouts 16 are each configured to accommodate the semiconductor modules 11 in such a way that cooling fins 18 are arranged in the cutouts 16 .
[0041] The three semiconductor modules 11 are each soldered to the receiving plate 14 in respective connection regions formed around the recesses 16 . The receiving plate 14 is provided for receiving the bypass flow breaker 21 . The bypass flow breaker 21 can optionally be arranged in the receiving plate 14 .
[0042] The flow-through interrupter 21 is designed as an enclosure surrounding the semiconductor ...
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