Packaging structure of microphone

A packaging structure and microphone technology, applied in the direction of electrostatic transducer microphone, microphone port/microphone accessories, etc., can solve the problems of unfavorable miniaturization design of silicon microphone, waste of space, etc. Acoustic performance, reasonable effect of structural design

Pending Publication Date: 2022-01-04
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Arranging the two side by side on the PCB will waste part of the space in the cavity, which is not conducive to the miniaturization design of the silicon microphone

Method used

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  • Packaging structure of microphone

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Embodiment Construction

[0029] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as any limitation of the application, its application or uses.

[0031] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0032] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodim...

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Abstract

The embodiment of the invention discloses a packaging structure of a microphone. The packaging structure of the microphone comprises an ASIC chip, an MEMS chip, a first rewiring layer and a second rewiring layer, wherein the ASIC chip is provided with a first rewiring layer distributed along the surface of the ASIC chip, and the ASIC chip is provided with a first silicon through hole penetrating through the thickness direction; the MEMS chip is provided with a second rewiring layer distributed along the surface of the MEMS chip, and the MEMS chip is provided with a second silicon through hole penetrating through the thickness direction; the ASIC chip is arranged on the MEMS chip in an overlapping manner; and the ASIC chip is connected with the MEMS chip through the first rewiring layer, the first through silicon via, the second rewiring layer and the second through silicon via. The packaging structure of the microphone is simple in structure and beneficial to miniaturization design of the microphone.

Description

technical field [0001] The present application belongs to the technical field of microphone packaging, and in particular, the present application relates to a packaging structure of a microphone. Background technique [0002] With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, among which silicon microphones have been widely used in mobile terminals due to their small size and strong stability. The silicon microphone includes a MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) chip, and the MEMS chip includes a silicon diaphragm and a silicon back plate. Among them, the working principle of the MEMS chip is to use the pressure gradient generated by the sound change to make the silicon diaphragm deformed by the sound pressure interference, and then change the capacitance value between the silicon diaphragm and the silicon back plate, thereby converting the sound...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H04R19/04
CPCH04R1/08H04R19/04
Inventor 王伟
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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