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Optoelectronic device and method of manufacture thereof

A technology of optoelectronic devices and devices, applied in lasers, optical components, electrical components, etc., can solve the problems of high optical loss, low device yield, complexity, etc.

Pending Publication Date: 2022-01-04
ROCKLEY PHOTONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, current solutions such as dual SOI mode converters have complex fabrication processes resulting in high optical losses and lower device yields

Method used

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  • Optoelectronic device and method of manufacture thereof
  • Optoelectronic device and method of manufacture thereof
  • Optoelectronic device and method of manufacture thereof

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Embodiment Construction

[0055] Aspects and embodiments of the invention will now be discussed with reference to the accompanying drawings. Other aspects and embodiments will be apparent to those skilled in the art.

[0056] Figure 1A and 1BA top view and a cross-sectional view of the photonic device 100 are shown, respectively. In general, the device 100 includes a 13-3 μm tapered waveguide 101a that acts as a mode converter (on the left-most edge) for light entering the device. Light is converted from the optical mode of the input fiber (not shown) to the 3 μm optical mode supported by the 3 μm waveguide 102b. The light then enters an optoelectronic device 103 comprising a 3 μm waveguide.

[0057] The process is then reversed and when the light exits the optoelectronic device 103 it is coupled into the 3μm tapered waveguide 102b which is coupled to the 3μm to 13μm tapered waveguide 101b. Light is converted from the 3 μm mode to the 13 μm mode and then travels onwards via an output fiber (not sh...

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Abstract

A method of manufacturing an optoelectronic device including a mode converter. The method has the steps of: on a first silicon-on-insulator (SOI) wafer, manufacturing the optoelectronic device; and either: on a second SOI wafer, manufacturing a mode converter; and bonding the mode converter to the first SOI wafer; or bonding a second SOI wafer to the first SOI wafer to form a combined wafer; and etching a mode converter into the combined wafer.

Description

technical field [0001] The present invention relates to optoelectronic devices and methods for their manufacture. Background technique [0002] In optoelectronic devices, there can be significant optical losses when a standard single-mode fiber (with a typical mode size of 10.6 μm at a wavelength of 1.55 μm) is coupled to a silicon waveguide that can have modes ranging from Mode sizes from sub-micron to 3 μm (depending on the silicon-on-insulator (SOI) platform used). [0003] To minimize coupling losses, 13 μm × 13 μm silicon waveguides have been used, since the mode size matches that of standard single-mode fiber. A mode converter or cone is used to adiabatically transition the mode from the 13 μm x 13 μm waveguide to the smaller silicon waveguide in the SOI platform. However, current solutions, such as dual SOI mode converters, have complex manufacturing processes that lead to high optical losses and lower device yields. [0004] There is thus a desire for a fabricatio...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/14G02B6/122
CPCG02B6/14G02B6/1228H01S5/026H01S5/1014
Inventor 余国民
Owner ROCKLEY PHOTONICS INC