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Connecting plate, substrate combination structure and electronic equipment

A combined structure and connecting board technology, applied in the electronic field, can solve problems such as abnormal plugging, spacing error, and misalignment

Pending Publication Date: 2022-01-25
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of plugging, due to the tolerances of the connecting board, the gold finger structure, and the solder connection manufactured by the gold finger connector, after the completion of the manufacturing, the spacing between the multiple gold finger structures has errors, and the multiple gold finger structures have errors. There is also an error in the spacing between the finger connectors. In this way, when multiple gold finger structures are plugged into multiple gold finger connectors, misalignment will occur, resulting in the phenomenon of not being able to plug in normally.

Method used

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  • Connecting plate, substrate combination structure and electronic equipment
  • Connecting plate, substrate combination structure and electronic equipment
  • Connecting plate, substrate combination structure and electronic equipment

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Embodiment Construction

[0054] Hereinafter, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, unless otherwise specified, "" means two or more.

[0055] In addition, in the present application, directional terms such as "upper", "lower", "left" and "right" are defined relative to the schematic placement of components in the drawings. It should be understood that these directional terms are Relative concepts, which are used in the description and clarification of relative, may change accordingly according to changes in the orientation of parts placed in the drawings.

[0056] In this application, unless otherwise specified and limited, the term "connection" s...

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Abstract

The embodiment of the invention provides a connecting plate, a substrate combination structure and electronic equipment, relates to the technical field of electronics, and can avoid the phenomenon that normal plugging cannot be performed due to dislocation when a plurality of golden finger structures are plugged with a plurality of golden finger connectors. The connecting plate is provided with a first golden finger structure and a second golden finger structure, the first golden finger structure is provided with a first fool-proof groove, the second golden finger structure is provided with a second fool-proof groove, and the width of the second fool-proof groove is greater than that of the first fool-proof groove. The connecting plate provided by the embodiment of the invention can be used for connecting electronic components.

Description

technical field [0001] The present application relates to the field of electronic technology, and in particular to a connecting board, a substrate assembly structure and electronic equipment. Background technique [0002] In the data center, in order to save internal space and accommodate as many hard disks as possible in a limited space, improvements are made to the structure where the hard disk is connected to other components, for example, a connecting finger structure is used to connect, that is , one side is a connection board with a gold finger structure, and the other side is a gold finger connector that can be connected to the gold finger structure, and the connection can be realized by inserting the gold finger structure on the connection board into the gold finger connector. Gold fingers are composed of many golden-yellow conductive contacts. Because the surface is gold-plated and the conductive contacts are arranged like fingers, they are called "gold fingers". G...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/02
CPCH05K1/117H05K1/02
Inventor 罗警怀陈林陈明罗飞
Owner HUAWEI TECH CO LTD