Electroless gold wire frame plugging and board collecting mechanism

Abstract

The invention provides an electroless gold wire frame plugging and board collecting mechanism. The electroless gold wire frame plugging and board collecting mechanism comprises a rack; a lifting mechanism, a frame plugging and positioning mechanism, a board clamping mechanism and a board frame conveying mechanism are arranged on the rack; the frame plugging and positioning mechanism is arranged on the lifting mechanism; the lifting mechanism and the board frame conveying mechanism are arranged on the rack side by side; the board frame conveying mechanism comprises an empty frame input mechanism and a full frame output mechanism; the empty frame input mechanism is arranged on the full frame output mechanism; the full frame output mechanism is arranged on the rack; and the frame plugging and positioning mechanism is used for sensing the board placing position of an empty plate frame on the empty frame input mechanism; and the board clamping mechanism is arranged on the rack, located above the frame plugging and positioning mechanism and used for plugging a board into the board placing position of the empty plate frame on the empty frame input mechanism through the frame plugging and positioning mechanism. With the electroless gold wire frame plugging and board collecting mechanism adopted, full-automatic operation is achieved, high-precision and high-efficiency frame plugging and board collecting operation is realized, and board frames can be automatically conveyed.

Description

technical field [0001] The invention relates to the technical field of circuit board receiving equipment, in particular to a gold wire insertion frame receiving mechanism. Background technique [0002] With the development of science and technology, there are more and more electronic products, which can be seen everywhere in our life, and one of the most important components in electronic products is the circuit board. The circuit board has high wiring density, light weight, thin thickness, and bendability. Good features, so when conveying and grabbing, it is necessary to protect the surface of the circuit board to prevent damage to the surface of the circuit board and increase unnecessary production costs. [0003] At present, in the board receiving equipment of circuit boards, when the mechanism for inserting frame and receiving boards is working, the accuracy is often not accurate enough, so that the boards collide or bend when inserted into the board frame, causing the b...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, there are more and more electronic products, which can be seen everywhere in our lives, and one of the most important components in electronic products is the circuit board. The circuit board has high wiring density, light weight, thin thickness, and bendability. Good features, so when conveying and grabbing, it is necessary to protect the surface of the circuit board to prevent damage to the surface of the circuit board and increase unnecessary production costs

[0003] At present, in the board receiving equipment of circuit boards, when the mechanism for inserting frame and receiving boards is working, the accuracy is often not accurate enough, so that the boards collide or bend when inserted into the board frame, causing the boards to be damaged and scrapped, not only Increased production costs and reduced work efficiency

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