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Laser module and laser device

A laser and laser technology, applied in the field of lasers, can solve problems such as poor heat dissipation of lasers

Pending Publication Date: 2022-02-01
BEIJING RECI LASER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The object of the present invention is to provide a laser module and a laser device to solve the technical problem of poor heat dissipation of the laser existing in the prior art to a certain extent

Method used

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  • Laser module and laser device
  • Laser module and laser device
  • Laser module and laser device

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Embodiment Construction

[0022] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0023] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0024] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the...

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Abstract

The invention relates to the technical field of lasers, in particular to a laser module and a laser device. The laser module comprises a shell, a laser main body and a heat exchange assembly, wherein the heat exchange assembly comprises a heat exchange channel; the laser main body is arranged in the shell, the heat exchange channel is fixed on the shell, the shell is provided with a medium inlet and a medium outlet which are communicated with the heat exchange channel, and the heat exchange channel is used for circulating a heat exchange medium. The laser module is cooled through flowing of the heat exchange medium, the efficiency is high, the heat exchange effect is good, and the requirement of the high-efficiency laser module for heat dissipation can be met. In addition, the heat exchange assembly is simple in structure, and a good sealing effect is easy to achieve. According to the invention, one laser module corresponds to one heat exchange assembly, and a plurality of laser modules correspond to a plurality of heat exchange assemblies, so that each laser module can be subjected to heat exchange, the heat exchange effect is good, and the heat exchange is uniform.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a laser module and a laser device. Background technique [0002] As a photoelectric device with high power density, semiconductor laser has high requirements on heat dissipation conditions. Poor heat dissipation conditions will lead to poor beam quality of the internal light-emitting chip and lead to overall failure of the device. A traditional heat dissipation method is passive conduction heat dissipation. The passive conduction heat dissipation method introduces more thermal resistance factors at the contact interface, and the heat conduction efficiency is low. With the increase of laser power, this traditional heat dissipation method cannot meet the requirements of high efficiency. The heat dissipation requirements of the laser make the heat dissipation effect of the laser poor. Contents of the invention [0003] The purpose of the present invention is to provide a laser mod...

Claims

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Application Information

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IPC IPC(8): H01S5/024
CPCH01S5/02407H01S5/02461H01S5/02476
Inventor 张强牛奔周春阳陈欣
Owner BEIJING RECI LASER TECH
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