Flexible printed circuit board pressure sensor module and preparation method and application thereof

Abstract

The invention provides a flexible printed circuit board pressure sensor module and a preparation method and application thereof, and relates to the technical field of flexible pressure sensors. The preparation method comprises the following steps: printing: taking a flexible substrate, dividing a pressure sensing area on the surface of the flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate; low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging mode, wherein the temperature of low-temperature packaging is below 200 DEG C; pressing: taking a reinforcing plate, smearing adhesive glue on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer; and forming: cutting the shape to obtain the flexible printed circuit board pressure sensor module. The flexible printed circuit board pressure sensor module prepared by the invention has the characteristics of flexible film and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.

Description

Technical field [0001] The present invention relates to the technical field of flexible pressure sensors, and more particularly to a flexible printed circuit board pressure sensor module and a preparation method thereof. Background technique [0002] With the rapid development of mobile Internet, people's demand and functional requirements for electronic consumer goods are increasingly high, and the development and application of flexible electronic equipment and wearable electronic equipment has broad market prospects. The pressure touch sensor is a sensor commonly used in electronic products, but it is still challenging in the process of flexible electronic devices. The flexible electronic device needs to be folded or bending, during bending and folding, the sensor perceived performance Due to mechanical pressure and degradation, changes or degradation, resulting in poor pressure sensing. Therefore, there is a need to develop a new pressure sensor module to accommodate the appl...

AI Technical Summary

Problems solved by technology

Pressure touch sensors are commonly used sensors in electronic products, but it is still quite challenging to apply them in the process of flexible electronic devices. Flexible electronic devices need to be folded or bent during use. Change or degradation due to mechanical stress and deformation, resulting in poor pressure sensing

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