Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)

A packaging method and technology in the horizontal direction, applied in the secondary processing of printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of high design and production costs, high costs, inability to achieve waterproof and shockproof, and achieve fast curing efficiency. , the effect of high production efficiency

Active Publication Date: 2022-02-08
SUZHOU KONIG ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Each of the above methods has its own advantages and disadvantages: direct spraying of conformal paint, although the operation is simple, convenient, and easy to implement, it cannot truly protect the circuit board, and cannot achieve waterproof and shockproof. After a long time, the package may fail; Potting, cumbersome operation, low efficiency, high cost, and poor reliability; low-pressure injection molding, using low-pressure injection molding equipment, through a special mold, adjusting the corresponding injection pressure and time to complete the packaging of the circuit board, the mold design and production costs of this method are relatively low High, the characteristics of the glue itself have a great influence on the package

Method used

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  • Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)
  • Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)
  • Packaging method and packaging equipment for PCBA (Printed Circuit Board Assembly)

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Embodiment Construction

[0124] In order to enable those skilled in the art to better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described The embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

[0125] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may be another element in between. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or it may be present intervenin...

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Abstract

The invention discloses a packaging method and packaging equipment of a PCBA. The PCBA comprises a printed circuit board and an electronic element arranged on the printed circuit board; and the maximum height of an electronic component relative to the surface of the printed circuit board is smaller than 1 cm. The packaging method comprises the steps: in the glue spraying process, controlling a glue spraying assembly to spray a UV glue solution to a target glue spraying area of the PCBA in a linear back-and-forth movement mode in the horizontal direction. According to the packaging method of the PCBA, the UV glue solution is sprayed to the area, needing to be protected, of the PCBA through the glue spraying assembly, and packaging protection of electronic components is achieved.

Description

technical field [0001] The present disclosure relates to the field of circuit board packaging, in particular to a PCBA board packaging method and packaging equipment. Background technique [0002] There are many packaging methods for PCBA (Printed Circuit Board+Assembly) boards, such as coating conformal paint on the surface of the circuit board, potting and low-pressure injection molding and other packaging methods. Each of the above methods has its own advantages and disadvantages: direct spraying of conformal paint, although the operation is simple, convenient, and easy to implement, it cannot truly protect the circuit board, and cannot achieve waterproof and shockproof. After a long time, the package may fail; Potting, cumbersome operation, low efficiency, high cost, and poor reliability; low-pressure injection molding, using low-pressure injection molding equipment, through a special mold, adjusting the corresponding injection pressure and time to complete the packaging...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/284Y02P70/50
Inventor 朱建晓
Owner SUZHOU KONIG ELECTRONICS TECH CO LTD
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