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Printed circuit board resin hole plugging and hole blasting repairing method

A technology for plugging holes in printed circuit boards and resins, which is applied in the fields of printed circuits, printed circuit manufacturing, electrical components, etc., and can solve problems such as blast holes that cannot be repaired

Active Publication Date: 2022-02-18
珠海杰赛科技有限公司 +2
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Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a method for repairing the blast holes of resin plug holes in printed circuit boards, so as to solve the technical problem that the blast holes in the back drill holes of some difficult products cannot be repaired after the resin plug holes are cured. The method repairs quickly and effectively, and the repaired products meet the quality requirements, improving the production pass rate

Method used

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  • Printed circuit board resin hole plugging and hole blasting repairing method
  • Printed circuit board resin hole plugging and hole blasting repairing method

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Embodiment Construction

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indic...

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Abstract

The invention relates to the technical field, and provides a printed circuit board resin hole plugging and hole blasting repairing method, which comprises the following steps of S1, scraping resin on a repaired hole by using a repairing knife, so that the resin in the repaired hole is flush with the surface of a circuit board; S2, extruding resin in the repaired hole out through a drilling tool; S3, detecting the cut-through repaired hole by adopting a magnifying lens; S4, supplementing oil to the position of the repaired hole; S5, curing the repaired hole to be repaired; S6, polishing the resin on the surface of the repaired hole to be flat through abrasive paper; and S7, checking whether the repaired hole is flat and has no concave hole or not, and if the repaired hole is not flat, repeating the steps S1-S6. Compared with the prior art, the method has the advantages that the technical problem that the back drilling holes of some difficult products cannot be repaired after the resin plugging hole is cured at present is solved, the repairing method is rapid and effective in repairing, the repaired products meet the quality requirements, and the production qualification rate is increased.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and more specifically relates to a repair method for resin plug hole explosion holes of printed circuit boards. Background technique [0002] Printed circuit boards have been invented for decades. As the basic components of electronic equipment, their functions are difficult to be replaced in the short term. With the diversification and refinement of products and the increasing difficulty of product production, more and more printed circuit boards use resin plugging technology. This technology has full plug holes and good reliability, which can meet the use requirements of products and make A common process for producing printed circuit boards. [0003] However, in the production process of this resin plugging process, some products with high production difficulty (such as PTFE sheet with back-drilling design, etc.) are prone to pop-out defects after the vertical plug-holes are cured, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094H05K3/0047H05K3/0044H05K2203/025H05K2203/0214
Inventor 聂小润张良昌冯涛齐国栋莫雪生
Owner 珠海杰赛科技有限公司
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