Protective member forming apparatus
A technology for protecting components and holding parts, applied to fine working devices, electrical components, and electric solid devices, etc., can solve problems such as damage, chip position offset, wrong chip, etc., and achieve the effect of suppressing damage
Pending Publication Date: 2022-02-22
DISCO CORP
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AI Technical Summary
Problems solved by technology
However, unlike the case of positioning a single wafer at a predetermined position, it is difficult to position the wafer at a predetermined position with an accuracy of 0.1 mm or less in the state of a wafer on a tape. When the stage is loaded, the position of the wafer may be shifted, and the wafer may be damaged by mistake during cutting
Method used
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[0027] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily conceived by those skilled in the art, and those that are substantially the same. In addition, the structures described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the structure can be made without departing from the scope of the present invention.
[0028] A protective member forming device according to an embodiment of the present invention will be described with reference to the drawings. figure 1 It is a side view which schematically shows the structural example of the integrated unit and the conveyance unit of the protective member forming apparatus of embodiment in partial cross section. figure 2 It is a cross-sectional view showing...
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The present invention provides a protective member forming apparatus capable of suppressing damage to a wafer and removing a protective component extending from an outer edge of a wafer. The protective member forming apparatus includes an integrating unit that integrates a resin sheet held by a chuck table with a wafer by a resin, a conveying unit that conveys the wafer, and a cutting unit that holds, by a cutting table, the wafer integrated with the resin sheet conveyed by the conveying unit and cuts the resin sheet by a cutting section along the wafer. The cutting unit includes a detection unit that images the wafer by a camera and detects a position of a periphery of the wafer, and a control unit that causes cutting of the resin sheet by the cutting section to be performed only in the case where a peripheral edge of the wafer detected coincides with a track of a cutter blade of the cutting section when the preset resin sheet is cut.
Description
technical field [0001] The present invention relates to a protective member forming device. Background technique [0002] In the process of manufacturing semiconductor device chips and various electronic components, there is a process of thinning or dividing a wafer on which various devices are formed into device chips. The wafer is processed while being held on the chuck table, but at this time, the front surface of the wafer is attached to a resin sheet such as an adhesive tape or a substrate to protect it so that the wafer does not break. [0003] For example, when the wafer has irregularities such as metal electrode bumps on the front surface, it is difficult to adhere the adhesive tape to the irregularities, and machining chips and machining fluid tend to enter the gaps and cause peeling. In addition, since the adhesive tape cannot sufficiently absorb the unevenness, there is a problem that the unevenness is transferred to the wafer when the back surface of the wafer i...
Claims
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IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/6835H01L21/67092H01L2221/68327H01L21/6836H01L2221/6834H01L21/67132H01L21/67259B28D5/0082B28D5/0064
Inventor 柿沼良典右山芳国
Owner DISCO CORP