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Computer radiating pipe machining device

A processing device and heat pipe technology, applied in energy-saving computing, grinding drive device, metal processing equipment, etc., can solve the problems of limited heat dissipation effect, high energy consumption and high cost, and achieve the effect of increasing processing efficiency and rapid positioning

Active Publication Date: 2022-03-01
HUBEI POLYTECHNIC UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the heat dissipation area of ​​the heat dissipation pipe is fixed, and the heat dissipation effect is limited. At this time, the heat dissipation performance of the heat dissipation pipe can be further improved by increasing the heat dissipation area of ​​the heat dissipation pipe. It is necessary to use a computer heat dissipation pipe processing device. The current computer heat dissipation pipe processing device When in use, it is often necessary to use multiple cylinders together to adjust the beating depth of the beating head, which consumes a lot of energy and costs

Method used

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  • Computer radiating pipe machining device
  • Computer radiating pipe machining device
  • Computer radiating pipe machining device

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Embodiment Construction

[0031] The following will be combined with Figure 1-7 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] see figure 1 , the present invention provides a computer cooling pipe processing device through improvement, including a support foot 1, a horizontal plate 2, a control panel 3, a power lead 4, a chute 5, a screw module 6, a positioning conveying mechanism 7 and a cleaning punch The wool mechanism 8, the support foot 1 is fixed to the four corners of the bottom of the horizontal plate 2, the positioning conveying mechanism 7 is embedded and ...

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Abstract

The invention discloses a computer heat dissipation pipe machining device which comprises a transverse plate, a sliding groove, a lead screw module, a positioning conveying mechanism and a cleaning and roughening mechanism. The positioning conveying mechanism is arranged at the upper end of the transverse plate, a positioning roller is embedded into the inner side of a heat dissipation pipe, the heat dissipation pipe is limited and fixed, and then a first motor is powered on to work; and meanwhile, a lead screw module conducts threaded transmission on the inner side of a moving block, the heat dissipation pipe is driven to enter the inner side of the cleaning and roughening mechanism to be roughened, and the beneficial effects that the heat dissipation pipe can be rapidly positioned and conveyed, and the machining efficiency is improved are achieved. The heat dissipation pipe enters the inner side of the roughening groove in a rotating state, the surface of the heat dissipation pipe is roughened through the roughening brush and the roughening head, meanwhile, the roughening depth of the roughening head can be adjusted through the adjusting mechanism, the surface of the heat dissipation pipe can be cleaned through the cleaning mechanism after roughening is completed, and the advantage of rapid roughening can be achieved.

Description

technical field [0001] The invention specifically relates to a processing device for computer cooling pipes, and relates to related fields of processing computer cooling pipes. Background technique [0002] The heat pipe is a heat transfer element with extremely high thermal conductivity. In the use of computer radiators, it is often necessary to apply heat pipes to assist in cooling the computer through the heat pipes, thereby preventing computer components from overheating. [0003] At present, the heat dissipation area of ​​the heat dissipation pipe is fixed, and the heat dissipation effect is limited. At this time, the heat dissipation performance of the heat dissipation pipe can be further improved by increasing the heat dissipation area of ​​the heat dissipation pipe. It is necessary to use a computer heat dissipation pipe processing device. The current computer heat dissipation pipe processing device When in use, it is often necessary to cooperate with multiple cylind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B5/35B24B5/36B24B41/04B24B41/06B24B47/12B24B47/22
CPCB24B5/36B24B5/35B24B41/067B24B47/12B24B47/22B24B41/04Y02D10/00
Inventor 丁才昌孙勇刘志远刘天印付蒙蒙周雅韩文奇吕盼罗港
Owner HUBEI POLYTECHNIC UNIV
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