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Heating device in semiconductor process equipment and semiconductor process equipment

A technology of heating device and process equipment, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve the problems of large influence of heating device and poor temperature compensation effect.

Pending Publication Date: 2022-03-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present application is to provide a heating device in semiconductor process equipment and semiconductor process equipment to solve the problem that the heating device in the existing semiconductor process equipment is greatly affected by the equipment environment, resulting in poor temperature compensation effect

Method used

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  • Heating device in semiconductor process equipment and semiconductor process equipment
  • Heating device in semiconductor process equipment and semiconductor process equipment
  • Heating device in semiconductor process equipment and semiconductor process equipment

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Embodiment Construction

[0022] Embodiments of the present application provide a heating device in semiconductor process equipment and the semiconductor process equipment, which are used to solve the problem that the heating device in existing semiconductor process equipment is greatly affected by the equipment environment, resulting in poor temperature compensation effect.

[0023] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this ap...

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Abstract

The embodiment of the invention discloses a heating device in semiconductor process equipment and the semiconductor process equipment, which are used for solving the problem that the heating device in the existing semiconductor process equipment is greatly influenced by the equipment environment, so that the temperature compensation effect is poor. The heating device comprises a plurality of heaters, a plurality of power cables, a power divider, a power supply and a controller, the power divider comprises a plurality of switch elements, each power cable is respectively connected with two switch elements, and the two switch elements are respectively connected to a positive electrode and a negative electrode of a power supply; the plurality of heaters are arranged in the chuck; two heaters are connected between any two power cables, and the conduction directions of the directional conduction elements corresponding to the two heaters are opposite; and the controller is used for sending a control signal to the power divider, and the control signal is used for controlling the switch-on or switch-off of each switch element, so that each power cable is connected to the positive electrode, the negative electrode or the open circuit. The heating device can achieve various temperature compensation effects.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and in particular to a heating device in semiconductor process equipment and semiconductor process equipment. Background technique [0002] During the etching process, some processes have higher requirements on the temperature control of the wafer, and higher requirements on the temperature uniformity of the wafer surface. Therefore, the electrostatic chuck in contact with the wafer needs to have a more refined temperature control function, and the temperature control of the main heating device on the original electrostatic chuck is gradually unable to meet the temperature control requirements of the process. In order to further improve the uniformity of the surface temperature of the wafer and make the electrostatic chuck have a more precise temperature control function, the prior art integrates auxiliary heaters (such as micro heaters, each of which is arranged in a matrix) in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67103H01L21/6833
Inventor 刘晓行
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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