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Semiconductor device and method for manufacturing semiconductor device

A semiconductor and conductor technology, applied in the fields of transistors, semiconductor devices and electronic equipment, can solve the problems of small leakage current and achieve the effects of large on-state current, good reliability and good electrical characteristics

Pending Publication Date: 2022-03-01
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, it is known that the leakage current of a transistor using an oxide semiconductor is extremely small in a non-conducting state

Method used

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  • Semiconductor device and method for manufacturing semiconductor device
  • Semiconductor device and method for manufacturing semiconductor device
  • Semiconductor device and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0073] In this embodiment, refer to Figures 1A to 17B An example of a semiconductor device including the transistor 200 a and the transistor 200 b according to one embodiment of the present invention and a method of manufacturing the same will be described. Note that the transistor 200a and the transistor 200b may be collectively referred to as the transistor 200 below.

[0074]

[0075] refer to Figure 1A to Figure 1D The structure of the semiconductor device including the transistor 200a and the transistor 200b will be described. Figure 1A is a plan view of the semiconductor device. Figure 1B to Figure 1D is a cross-sectional view of the semiconductor device. here, Figure 1B is along Figure 1A The cross-sectional view of the dotted line A1-A2 in , which is equivalent to the cross-sectional view along the channel length direction of the transistor 200a and the transistor 200b. Figure 1C is along Figure 1A The cross-sectional view of the dotted line A3-A4 in , wh...

Embodiment approach 2

[0437] In this embodiment, refer to Figure 17A to Figure 22 One embodiment of a semiconductor device that can be used as a memory device will be described.

[0438] [storage device 1]

[0439] Figure 17A An example of a semiconductor device (storage device) according to one embodiment of the present invention is shown. Figure 17A In the illustrated semiconductor device, a capacitor 100a is arranged on a transistor 200a and a capacitor 100b is arranged on a transistor 200b. Note that capacitor 100 a and capacitor 100 b may be collectively referred to as capacitor 100 hereinafter.

[0440] As the transistor 200a and the transistor 200b, the transistor 200a and the transistor 200b described in the above embodiment can be used. That is to say, Figure 17A The semiconductor device shown has the Figure 1A to Figure 1D The semiconductor device shown has a structure in which a capacitor 100a and a capacitor 100b are provided. Note that the structures of the transistor 200a ...

Embodiment approach 3

[0546] In this embodiment, refer to Figure 23A , Figure 23B as well as Figure 24A to Figure 24C , a storage device (hereinafter sometimes referred to as an OS storage device) using a transistor using an oxide as a semiconductor (hereinafter sometimes referred to as an OS transistor) and a capacitor according to one embodiment of the present invention will be described. An OS storage device is a storage device including at least a capacitor and an OS transistor that controls charge and discharge of the capacitor. The OS memory device has excellent retention characteristics because the off-state current of the OS transistor is extremely small, and thus can be used as a nonvolatile memory.

[0547]

[0548] Figure 23A An example of the structure of the OS storage device is shown. The memory device 1400 includes a peripheral circuit 1411 and a memory cell array 1470 . The peripheral circuit 1411 includes a row circuit 1420 , a column circuit 1430 , an output circuit 144...

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Abstract

Provided is a semiconductor device that can be miniaturized or highly integrated. The semiconductor device includes a first conductor disposed on a substrate, an oxide disposed so as to be in contact with a top surface of the first conductor, a second conductor, a third conductor, and a fourth conductor disposed on the oxide, and a first insulator disposed on the second conductor to the fourth conductor and having a first opening and a second opening formed therein. A first insulator disposed in the first opening, a second insulator disposed in the first opening, a fifth conductor disposed on the second insulator, a third insulator disposed in the second opening, and a sixth conductor disposed on the third insulator, the third conductor being disposed so as to be disposed on the first conductor; the first opening overlaps a region between the second conductor and the third conductor, and the second opening overlaps a region between the third conductor and the fourth conductor.

Description

technical field [0001] One aspect of the present invention relates to a transistor, a semiconductor device, and electronic equipment. Another aspect of the present invention relates to a method of manufacturing a semiconductor device. Furthermore, one aspect of the present invention relates to a semiconductor wafer and a module. [0002] Note that in this specification and the like, a semiconductor device refers to all devices that can operate by utilizing semiconductor characteristics. In addition to semiconductor elements such as transistors, semiconductor circuits, arithmetic devices, and storage devices are also one form of semiconductor devices. Display devices (liquid crystal display devices, light-emitting display devices, etc.), projection devices, lighting devices, electro-optical devices, power storage devices, storage devices, semiconductor circuits, imaging devices, electronic equipment, etc. may include semiconductor devices. [0003] Note that one aspect of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/108H01L21/8242H01L29/786H10B12/00H10B99/00
CPCH01L29/7869H10B12/30H10B12/02H01L29/66969H10B12/315H10B12/05H10B12/033H01L21/8258H01L27/0688H01L29/78648H01L27/088H01L29/786H10B12/00H01L27/1207H01L27/1225H01L27/1255
Inventor 大贯达也松嵜隆德山崎舜平
Owner SEMICON ENERGY LAB CO LTD