Board-level fan-out type packaging structure and manufacturing method thereof
A packaging structure, fan-out technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as uneven stress, increased growth costs, product warpage, etc.
Pending Publication Date: 2022-03-04
HUATIAN TECH KUNSHAN ELECTRONICS
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the existing board-level fan-out packaging technology adopts a packaging structure designed on one side. During the manufacturing process, due to the uneven stress on the single-sided board-level fan-out packaging structure, the product will warp. Production efficiency will be greatly reduced, increasing the cost of growth
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] It should be noted that the use of words such as "first" and "second" to define parts is only for the convenience of distinguishing corresponding parts. Limitation of the scope of protection of the invention.
[0036] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0037] It can be understood that the present invention achieves the purpose of the present invention through some embodiments.
[0038] Such as figure 1 As shown, the temporary carrier provided by the present invention includes: a plastic sealing layer 14, on which a chip 12, a temporary bonding layer 11 and a carrier sheet 10 are sequentially arranged, and a plurality of chips are connected on the chip 12 Conductive bumps 13; the carrier sheet 10 is made of silicon, glass, metal or organic material or a combination of multiple materials; in this embodiment, the carrier sheet 10 is preferably metal.
[0039] Such as figure ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a board-level fan-out packaging structure and a manufacturing method thereof, the board-level fan-out packaging structure comprises a temporary support plate, the temporary support plate comprises a first temporary support plate and a second temporary support plate, the first temporary support plate and the second temporary support plate are connected in a closed manner through a bonding layer to form an integral composite plate, so that the integral composite plate is flat, and the first temporary support plate and the second temporary support plate are connected in a closed manner; the bonding layer is connected with the first temporary support plate and the second temporary support plate in a closed manner, so that a bonding cavity can be formed in the integral composite plate, and vacuum negative pressure exists in the bonding cavity; in this way, overall packaging of a larger area can be achieved, the packaging efficiency is further improved, the packaging cost is reduced, the fan-out type packaging structure with the double-face symmetrical design enables a product to be evenly stressed, the problem that the product can warp is effectively solved, meanwhile, the manufacturing and production efficiency can be greatly improved, and therefore the cost is reduced.
Description
technical field [0001] The invention relates to the technical field of board-level fan-out packaging, in particular to a board-level fan-out packaging structure and a manufacturing method thereof. Background technique [0002] With mobile consumer electronic products such as mobile phones, computers, and digital summaries, the requirements for functional integration, large storage space, high reliability, and miniaturized packaging are getting higher and higher. become mainstream. In order to match the speed of its development, the chips used are developing in the direction of higher density, faster speed, smaller size and lower cost. At the same time, as the functions of current electronic products become more and more abundant, the number of I / Os of the fan-in packaging structure can no longer meet the product requirements. As a type of wafer-level packaging, the fan-out (FO) packaging structure is aimed at The main advanced packaging technology with a large number of in...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L23/528H01L23/31H01L21/50H01L21/56
CPCH01L23/5283H01L23/3107H01L21/50H01L21/561H01L21/568
Inventor 肖智轶马书英刘吉康王姣
Owner HUATIAN TECH KUNSHAN ELECTRONICS