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Alignment device

An alignment device and mounting technology, applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of a large number of components, large size, and complex structure, and achieve large installation space, miniaturization, The effect of fewer components

Pending Publication Date: 2022-03-15
DAIHEN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, ball screws and guide members are required for each linear motion axis, and a large number of components are required.
For this reason, in the above-mentioned alignment device, the number of components increases, which leads to a complication and size increase of the structure of the device as a whole.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0059] Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

[0060] Figure 1 to Figure 4 The alignment device according to the first embodiment of the present invention is shown. The alignment apparatus A1 of this embodiment is provided with the 1st rotation drive mechanism 1, the 2nd rotation drive mechanism 2, and the lift mechanism 3, and is used for correcting the positional deviation of the semiconductor wafer which is a thin-plate-shaped workpiece|work W, for example. The workpiece W is carried into the processing chamber by, for example, a transfer robot, and the alignment device A1 is configured to correct the positional deviation of the workpiece W from a predetermined reference position before being carried into the processing chamber.

[0061] The first rotary drive mechanism 1 such as figure 1 , figure 2 As shown, it has the 1st support part 11, the 1st drive source 12, the 1st arm 13, the 1st dri...

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PUM

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Abstract

The invention provides an alignment device capable of correcting position deviation in a plane direction (X-Y direction) and a rotation direction (theta direction) around a vertical axis through few driving shafts. An alignment device (A1) is provided with: a first rotational drive mechanism (1) having a first support section (11) for supporting a workpiece (W), and a first drive source (12) for rotationally driving the first support section (11) about a first vertical axis (V1); a second rotational drive mechanism (2) having a second support section (21) for supporting the workpiece (W) and a second drive source (22) for rotationally driving the second support section (21) about a second vertical axis (V2); and a lifting mechanism (3) for moving the workpiece (W) supported by the second support part (21) up and down.

Description

technical field [0001] The present invention relates to alignment devices. More specifically, the present invention relates to a technique for correcting the positional deviation of the workpiece based on positional deviation amount information from a reference position of the workpiece (semiconductor wafer, etc.). Background technique [0002] An example of a conventional semiconductor process will be described. After the wafer (workpiece) is transported into the load lock chamber (Load lock chamber), it is transported into the processing chamber by the transport robot. Depending on the content of the processing to be performed in the processing chamber, it is necessary to accurately transport the wafer to a reference position in the processing chamber. For this purpose, conventionally, for example, as disclosed in Patent Document 1, an alignment device has been used. The alignment device is used at the stage before the workpiece is transported into the processing chambe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
CPCH01L21/68H01L21/6875H01L21/68742H01L21/68764
Inventor 井浦惇
Owner DAIHEN CORP