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Plasma processing equipment

A technology for processing equipment and plasma, used in discharge tubes, electrical components, electrical solid devices, etc., can solve the problems of plasma escape, inability to limit the plasma processing range, and reduce the performance of display panels, so as to improve performance and prevent escape Effect

Pending Publication Date: 2022-03-18
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present application provides a plasma processing equipment, which can solve the problem that the plasma in the existing plasma processing equipment will escape to the back side of the substrate to be processed, and the range of plasma processing cannot be limited, resulting in a decrease in the performance of the display panel. question

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Embodiment 1

[0029] see figure 2 , image 3 , figure 2 It is a first cross-sectional schematic diagram of a plasma processing equipment 100 provided in the embodiment of the present application; image 3 It is a schematic diagram of a first top view structure of a plasma processing equipment 100 provided in an embodiment of the present application. image 3 for figure 2 Top view of a medium plasma processing facility.

[0030] The embodiment of the present application provides a plasma processing equipment 100 for forming plasma 40 in a designated area of ​​a substrate 30. The plasma processing equipment 100 includes a plasma generator 10 and a negative pressure device 20. The plasma generator 10 is used to generate Plasma 40, the plasma generator 10 includes at least one gas outlet, the gas outlet of the plasma generator 10 is used to output the plasma 40 to the designated area of ​​the substrate 30; the negative pressure device 20 is arranged on the outside of the plasma generator...

Embodiment 2

[0063] This embodiment is the same or similar to the above embodiments, except that the negative pressure device 20 further includes an extension wall 231 .

[0064] see Figure 4 , Figure 5 , Figure 6 , Figure 4 A schematic diagram of a second cross-sectional structure of a plasma processing device 100 provided in an embodiment of the present application; Figure 5 A schematic diagram of a third cross-sectional structure of a plasma processing equipment 100 provided in an embodiment of the present application; Figure 6 It is a schematic diagram of a second top view structure of a plasma processing equipment 100 provided in an embodiment of the present application. Figure 6 for Figure 4 or Figure 5 A top view of the plasma processing apparatus 100 .

[0065] In some embodiments, the negative pressure device 20 includes a first side wall 23 away from the plasma generator 10 and a second side wall 24 close to the plasma generator 10, the first side wall 23 and the ...

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Abstract

The embodiment of the invention discloses plasma processing equipment, which is characterized in that a negative pressure device is arranged on one outer side or the periphery of a plasma generator, and the negative pressure device can extract plasmas which are about to escape and exceed a plasma processing range, so that the plasmas are prevented from escaping to the back surface of a to-be-processed surface of a to-be-processed substrate; the range of plasma processing can be limited, so that the performance of the display panel is improved.

Description

technical field [0001] The present application relates to the display field, in particular to a plasma processing device. Background technique [0002] Organic light emitting display panels (Organic Light Emitting Diode, OLED) have the advantages of simple structure, self-illumination, fast response, ultra-thin, low power consumption, etc., organic light emitting display panels are being vigorously developed by major display manufacturers. During the production of organic light-emitting display panels, it is necessary to perform plasma (plasma) treatment on the surface of the substrate to reduce the contact angle, such as figure 1 as shown, figure 1 is a schematic diagram of a prior art plasma processing apparatus, figure 1 It illustrates the process of performing plasma treatment on the substrate in the prior art. The plasma generator 10 introduces gas through the first gas inlet 11, and outputs the plasma 40 outward along the first direction y through the first gas outle...

Claims

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Application Information

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IPC IPC(8): H01J37/32H01L51/56
CPCH01J37/3244H01J37/32449H01J37/32834H10K71/00
Inventor 曾辉
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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