Shell, shell assembly and electronic equipment
A shell and shell technology, which is applied to the structural parts of electrical equipment, electrical equipment shells/cabinets/drawers, casings/cabinets/drawer parts, etc., which can solve the problem of electronic equipment getting stuck and holding electronic equipment hot , Electronic equipment operating efficiency decline and other issues, to achieve the effect of lower temperature and rapid heat dissipation
Pending Publication Date: 2022-03-25
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Application Information
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Problems solved by technology
Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device
Method used
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[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.
[0025] With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become indispensable tools for people. When faced with a wide range of mobile terminal products, consumers not only need to consider whether the functions of the products meet their own needs, but also the appearance of the products is one of the important factors that determine whether consumers choose or not. However, with the iteration of mobile terminals, the appeara...
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The embodiment of the invention provides a shell which comprises a cover plate and a heat dissipation assembly, the heat dissipation assembly comprises an evaporation cavity, a heat dissipation flow channel, a backflow pipeline, a decoration cavity and a dynamic function part arranged in the decoration cavity, the evaporation cavity communicates with the decoration cavity through the heat dissipation flow channel and the backflow pipeline, and the evaporation cavity is filled with a phase change medium of a first phase; when the phase-change medium is changed into a second phase and enters the heat dissipation flow channel, the dynamic function piece is driven to change in the phase-change medium form, and then the phase-change medium flows back to the evaporation cavity through the backflow pipeline. The shell and the evaporation cavity are arranged corresponding to the heating element of the electronic equipment, when the heating element emits heat, the phase change medium in the evaporation cavity can diffuse heat, and the phase change medium in the moving process can also act on the dynamic function part and drive the dynamic function part to change the form, so that part of heat energy is converted into mechanical energy to be consumed; heat can be quickly dissipated, and the dynamic effect of the shell can also be achieved. In addition, the embodiment of the invention further provides a shell assembly and electronic equipment.
Description
technical field [0001] The present application relates to the field of consumer electronic products, in particular to a housing, a shell assembly and electronic equipment. Background technique [0002] With the development of communication technology, electronic devices such as mobile phones and tablet computers have become indispensable tools for people. The power supply of electronic equipment or other electronic devices will generate a lot of heat during operation, which will increase the overall temperature of the electronic equipment. When the temperature rises sharply, there is a risk of spontaneous combustion. Some current electronic devices will automatically take some measures to reduce power consumption after the temperature rises, which leads to a decrease in the operating efficiency of the electronic device, causing the electronic device to become stuck; at the same time, the user will feel hot when holding the electronic device. Contents of the invention [0...
Claims
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IPC IPC(8): H05K5/02H05K7/20
CPCH05K5/0217H05K7/2029H05K7/20309H05K7/20327
Inventor 叶万俊
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD