Cassette and its carrying device and pick-and-place device, semiconductor processing equipment

Abstract

The present invention provides a chip box, its carrying device, pick-and-place device, and semiconductor processing equipment. The carrying device includes a plurality of carrying components arranged at relative intervals and at least one lifting mechanism, and the plurality of carrying components are movably arranged in the chip box; The lifting mechanism is connected with the plurality of bearing assemblies, and the lifting mechanism can lift and lower the plurality of bearing assemblies to adjust the distances between the plurality of bearing assemblies. The carrier device of the present invention can well avoid scratches, dirt, bump damage and misplacement on the surface of the wafer when taking and placing the wafer from the carrier device of the cassette by adjusting the distance between the plurality of carrier components. Effective protection of the wafer surface to avoid damage.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a chip cassette, a carrying device, a pick-and-place device, and a semiconductor processing device. Background technique [0002] With the continuous expansion of the scale of the semiconductor industry, the number of substrates, semi-finished products and finished products used has increased sharply, and the requirements for the film cassettes required for storage have also continued to increase. , The substrates are placed layer by layer, with small and fixed intervals in the middle. When picking and placing substrates, semi-finished products and finished products, scratches, dirt, bump damage and other phenomena are often caused to the surface of the substrate. [0003] In view of the above-mentioned problems, it is necessary to propose a wafer cassette, its carrying device, pick-and-place device, and semiconductor processing equipment with a reasonable desi...

AI Technical Summary

Problems solved by technology

[0002] With the continuous expansion of the semiconductor industry, the number of substrates, semi-finished products and finished products used has increased sharply, and the requirements for the cassettes required for storage have also continued to increase. The existing cassettes are integrally formed by molds and composed of support tables on both sides. , the substrates are placed layer by layer, and the middle interval is small and fixed. When picking and placing the substrate, semi-finished products and finished products, it often causes scratches, dirt, bump damage, etc. on the surface of the substrate.

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