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Holding mechanism

A technology of holding mechanism and holding part, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid state devices, etc., and can solve the problems of being unable to hold ring frames

Pending Publication Date: 2022-04-05
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the holding mechanism, the jig that clamps the ring frame is a structure that clamps the ring frame from above by rotating the standing plate so that it can be laid horizontally. The ring frame cannot be retained in the retaining mechanism when the mechanism positions the ring frame with sufficient precision

Method used

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Embodiment Construction

[0019] Hereinafter, a holding mechanism according to an embodiment of the present invention will be described with reference to the drawings.

[0020] refer to figure 1 For explanation, the holding mechanism indicated by reference numeral 2 as a whole includes: a wafer holding unit 4 that sucks and holds a wafer;

[0021] The wafer holding unit 4 includes a disc-shaped suction chuck 8 and a case 10 fitted on the outer periphery of the suction chuck 8 . The suction chuck 8 is formed of a porous material, and is connected to a suction unit (not shown) through a flow path. Such as figure 1 As shown, the upper surface of the adsorption chuck 8 is exposed, while the outer peripheral portion and the lower surface of the adsorption chuck 8 are covered by the housing 10 . Then, in the wafer holding unit 4 , the suction unit is operated to generate suction force on the upper surface of the suction chuck 8 , thereby suctioning and holding the wafer placed on the upper surface of the ...

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PUM

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Abstract

The invention provides a holding mechanism which can reliably hold an annular frame even if the annular frame is not fully and precisely positioned. The holding mechanism includes: a wafer holding portion that attracts and holds the wafer; and a frame support part which is disposed on the outer periphery of the wafer holding part and supports the frame. The frame support portion includes a permanent magnet.

Description

technical field [0001] The present invention relates to a holding mechanism for holding a frame unit. A wafer is positioned in an opening of an annular frame formed of a ferromagnetic material having an opening for accommodating the wafer in the center, and the wafer and the annular frame are attached to an adhesive tape. The frame unit is obtained by integrating the ring frame with the wafer. Background technique [0002] On the front surface of the wafer, a device area and a peripheral remaining area surrounding the device area are formed. In the device area, multiple devices such as ICs and LSIs are divided by a plurality of intersecting dividing lines, and the back surface of the wafer is ground to form a After the desired thickness is obtained, it is divided into individual device chips by a dicing device or a laser processing device, and the device chips obtained by dividing are used in electronic equipment such as mobile phones and personal computers. [0003] And, b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/683
CPCH01L21/6838H01L21/68728H01L21/68707H01L21/67028H01L21/67092H01L21/67132H01L21/6836H01L2221/68327H01L21/67778
Inventor 斋藤良信柿沼良典森俊
Owner DISCO CORP