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Wire bonding structure of semiconductor package

A technology of wire bonding and packaging, which is applied in the field of wire bonding structure, and can solve problems such as unbalanced force on the connection point of the wire, poor supporting force, poor bonding between the solder joint of the wire and the RDL, etc.

Pending Publication Date: 2022-04-12
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The unevenness of the surface of the RDL will cause the problem of unbalanced force on the connection points of the leads on the RDL when the leads are connected to the surface of the RDL
[0004] 2. RDL is usually embedded in a dielectric material (polyimide PI). Since the PI material is soft and has poor support, when the wire is bonded to the surface of the RDL, the wire bonding force is easily absorbed by the PI.
[0005] The above two points will cause poor bonding between the lead solder joint and the RDL

Method used

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  • Wire bonding structure of semiconductor package
  • Wire bonding structure of semiconductor package
  • Wire bonding structure of semiconductor package

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Embodiment Construction

[0034] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course these are merely examples and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are in direct contact, or may include forming an additional component between the first component and the second component An embodiment such that the first part and the second part may not be in direct contact. Also, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for brevity and clarity only and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0035] ...

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Abstract

The invention relates to a wire bonding structure of a semiconductor package and a forming method thereof. The wire bonding structure comprises a redistribution layer; the strengthening layer is located on the redistribution layer; a bonding pad on the strengthening layer; and a first electronic element over the redistribution layer and electrically connected to the bond pad through a bond wire.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a wire bonding structure of a semiconductor package. Background technique [0002] Such as figure 1 As shown, in a current fan-out substrate (Fan-out substrate), a redistribution (RDL) layer 10 is disposed above a substrate 30 , and a chip 20 is attached on the RDL layer 10 . Usually, wires (Wire bonding) 15 are used to connect the RDL layer 10 of the fan-out substrate and the chip 20 attached thereon, but this connection method usually encounters the following problems: [0003] 1. The unevenness of the surface of the RDL will cause the problem of unbalanced force on the connection points of the leads on the RDL when the leads are connected to the surface of the RDL. [0004] 2. RDL is usually embedded in a dielectric material (polyimide PI). Since the PI material is soft and the supporting force is not good, when the wire is bonded to the surface of th...

Claims

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Application Information

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IPC IPC(8): H01L23/498H01L23/49
CPCH01L2224/92247H01L2224/83192H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014
Inventor 刘旭唐张皇贤
Owner ADVANCED SEMICON ENG INC
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