Printing bonding pad supporting framework

Abstract

The invention is suitable for the technical field of printing pads, and provides a printing pad supporting framework, which comprises a supporting assembly comprising an upper cover and a lower cover, the top surface of the upper cover is provided with a top hole, the bottom surface of the upper cover is provided with a plurality of locking rods, the top surface of the lower cover is provided with positioning grooves matched with the locking rods, the side wall of each positioning groove is provided with a sliding groove, and the top of each sliding groove is elastically connected with a locking block; the bottom of the sliding groove is provided with a separating block, the separating block is provided with a containing groove matched with the locking block, the locking block is provided with a guide rod penetrating through the separating block, a lifting column penetrates through the bottom face of the lower cover, the bottom of the lifting column is movably connected with a plurality of first connecting rods, and the first connecting rods are connected with the middles of second connecting rods. The top end of the second connecting rod is movably connected with the lower cover. Therefore, the bonding pad can be firmly fixed on the circuit board, effective support can be provided for the bonding pad, and soldering paste can be concentrated to avoid tin connection.

Description

technical field [0001] The present invention relates to the technical field of printed pads, in particular to a support structure for printed pads. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. In common multilayer printed circuit boards, there are usually pads, insulating layers and circuit layers from top to bottom, where the pads are located on the insulating layer. On the upper surface of the layer, the insulating layer is formed with a through hole, and the pad is connected to the circuit layer through the conductive layer at the through hole. Sometimes, the position of the pad will correspond to the position of the through hole, and part or all of it will fall in the through hole. In this case, the processing of the pads will be unreliable, and it is easy to cause false soldering due to unevenness and collapse of the pads. [0003] Publication No. CN2134036...

AI Technical Summary

Problems solved by technology

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. In common multilayer printed circuit boards, there are usually pads, insulating layers and circuit layers from top to bottom, where the pads are located on the insulating layer. On the upper surface of the layer, the insulating layer is formed with a through hole, and the pad is connected to the circuit layer through the conductive layer at the through hole. Sometimes, the position of the pad will correspond to the position of the through hole, and part or all of it will fall in the through hole. In this case, the processing of the pad will be unreliable, and it is easy to cause false soldering due to unevenness and collapse of the pad.

[0003] Publication No. CN213403647U "A Circuit Board Soldering Pad with a Stable Supporting Structure" provides a supporting structure using insulating blocks and support rods to realize the overall support of the soldering pad, but the defect of this support method is that the solder pad cannot be fixed , the pad will fall off when it is bumped, which will affect the use

[0004] In summary, there are obviously inconveniences and defects in the actual use of the existing technology, so it is necessary to improve

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