Computer heat dissipation structure

Abstract

The invention provides a computer heat dissipation structure, and relates to the technical field of computer equipment. The computer heat dissipation structure comprises a main mounting mechanism, an air supply mechanism and a refrigeration heat dissipation mechanism, the refrigeration heat dissipation mechanism is arranged on the right side of the main mounting mechanism, and the air supply mechanism is arranged on the front side of the main mounting mechanism; the air supply mechanism comprises an air guide base, a fixing cylinder, a first cross-shaped fixing frame, a second cross-shaped fixing frame, a first air supply fan blade, a first driving motor, a mounting cylinder, a second air supply fan blade, a first bevel gear, a second bevel gear and an auxiliary bevel gear. Cooling air in the same direction can be generated at the same time, vortexes generated by first air supply fan blades and second air supply fan blades can be counteracted, energy loss generated by the vortexes is reduced to the minimum, the utilization rate of the cooling air is increased, dust accumulated on multiple sets of infusion rods for a long time can be swung off through circular motion of linkage columns, and the service life of the infusion rods is prolonged. And falling out from an opening in the bottom of the main mounting frame.

Description

technical field [0001] The invention relates to the technical field of computer equipment, in particular to a computer cooling structure. Background technique [0002] A computer's CPU chip emits heat during use. In order to ensure the normal operation of the CPU, the heat generated by it must be dissipated in time. Otherwise, under the condition of insufficient heat dissipation, let the CPU continue to work under high temperature conditions, and finally the entire circuit inside the CPU will be short-circuited, resulting in damage to the CPU. [0003] The cooling fins of the current CPU cooling device will accumulate a lot of dust after long-term use, which seriously affects the cooling of the CPU. To clean the cooling fins, you need to open the host computer, and then remove the CPU cooling device, and the cooling fins themselves There are multiple sets at intervals up and down, and it is very troublesome to clean up. This causes computer users not to clean the computer ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides a computer heat dissipation structure, which solves the problems that the dust in the heat dissipation structure cannot be cleaned in time and the eddy current of the fan

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