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Packaging process of power electronic transformer based on 3D photo-curing printing

A technology of power electronics and packaging technology, which is applied in the manufacture of inductors/transformers/magnets, packaging/impregnation, and circuits. deformation effect

Active Publication Date: 2022-06-03
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the existing technology, the present invention provides a packaging process for power electronic transformers based on 3D photo-curing printing, which solves the problems of easy cracking and difficult heat dissipation of transformer packages

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0062] The casting body is heated and cured;

[0064] After the resin is fully cured, take out and polish to obtain a complete package.

[0068] The casting body shrinks during curing, resulting in shrinkage cavities; current methods are through external ovens or

[0069] The winding is energized, the winding is heated first, and the casting body is cured from the inside to the outside. This curing sequence allows the external resin

[0071] The high voltage direct current voltage is greater than 1kV.

[0074] The temperature of the thermal curing is not lower than 70°C.

[0076] The embedded part includes an epoxy tube and / or a rubber rod, which is convenient for drawing out after packaging and curing.

[0082] The casting body shrinks during curing, resulting in shrinkage cavities; current methods are through external ovens or

[0083] The winding is energized, the winding is heated first, and the casting body is cured from the inside to the outside. This curing sequence allows t...

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Abstract

The invention provides a packaging process of a power electronic transformer based on 3D photo-curing printing, and relates to the technical field of transformer packaging. The process includes the following steps: printing skeleton network, pouring, applying voltage, applying ultrasonic waves, passing current, heat curing, and grinding; at the beginning of packaging, epoxy resin printing skeleton network is used to position and fix the iron core and winding, effectively preventing the winding from Loose or deformed during the packaging process, using epoxy resin containing fillers as the casting body can significantly reduce thermal resistance and expansion coefficient, improve heat dissipation performance, and reduce the risk of cracking; epoxy resin is easy to electrowet to solids in high-voltage electric fields; ultrasonic It has the characteristics of improving the wetting ability, further improving the wetting effect of the filler-containing resin and the skeleton network; electrifying the winding to make the winding heat first, and the casting body is cured from the inside to the outside, allowing the external resin to automatically feed the shrinkage cavity, thereby significantly reducing Encapsulates internal defects and improves the reliability of the encapsulation.

Description

Packaging technology of power electronic transformer based on 3D photocuring printing technical field The present invention relates to the technical field of transformer packaging, in particular to a power electronic transformer based on 3D photocuring printing. The packaging process of the voltage device. Background technique [0002] In recent years, the application of power electronic technology in the power system has become more and more extensive and in-depth. high frequency transformer The edge design affects the overall safety, applicability and power density of the transformer, especially the large-capacity high-frequency transformer, its voltage, etc. High level, which puts forward higher requirements for insulation design, how to ensure the stability of insulation in the environment of high voltage and high heat has become a research problems. The packaging technology of the module is an important part of the power electronic system integration, which may ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/00
CPCH01F41/005
Inventor 王丽洋赵玉顺豆宏利戴义贤廖呈成孙菲双
Owner HEFEI UNIV OF TECH
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