Cooling system

Abstract

The invention discloses a cooling system. The cooling system is used for cooling an electronic device. The cooling system comprises a pipeline mechanism and a driving mechanism; the pipeline mechanism comprises a cooling pipe set containing cooling fluid, the cooling pipe set is provided with a first heat exchange section (111), and the first heat exchange section (111) is configured to be capable of exchanging heat with the electronic device; the driving mechanism comprises a shell (310), a driving part and a driving source, the shell (310) is in fluid communication with the cooling pipe set, the driving part is arranged in the shell (310), and the driving source is arranged outside the shell (310) and is configured to control the driving part to drive the cooling fluid to flow. The cooling system is good in cooling effect and low in failure rate, can be suitable for various electronic systems of different structures, and does not interfere with electronic devices.

Description

technical field [0001] The invention relates to the technical field of cooling and heat dissipation, in particular to a cooling system. Background technique [0002] Electronic devices (such as 5G equipment) will generate heat during work, and when the temperature of the electronic device is too high, its performance will be affected. Therefore, it is necessary to effectively dissipate heat from the electronic device to ensure its working stability and efficiency. [0003] At present, the traditional cooling system for electronic devices is to cool and dissipate the electronic devices in the form of cooling liquid flow, which requires the cooling liquid to circulate continuously so that heat exchange occurs with the electronic devices when the cooling liquid flows through the electronic devices Thereby heat dissipation and cooling are realized. However, the prior art has the following problems: 1. The driving mechanisms used to drive the flow of coolant are all metal materi...

AI Technical Summary

Problems solved by technology

However, the prior art has the following problems: 1. The driving mechanisms used to drive the flow of coolant are all metal materials, which can interfere or shield electronic wireless signals; 2. When the coolant circulation path needs to be changed, the cooling system Cannot make adaptive changes, and cannot be widely applied to electronic systems of different structures; 3. Due to the limitation of the setting form of the coolant circulation path, the drive mechanism is usually set corresponding to the electronic device, which leads to considerable restrictions on the placement position of the drive mechanism

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