Vapor chamber with upper heat dissipation module and lower heat dissipation module

Abstract

The invention relates to the technical field of heat dissipation. The invention aims to provide a vapor chamber of an upper-lower double-heat-dissipation module. The vapor chamber comprises a first vapor chamber body. The first vapor chamber comprises an upper cover plate and a lower cover plate; the size of the upper cover plate is larger than that of the lower cover plate, a back plate is further arranged on the face, away from the lower cover plate, of the upper cover plate, and the back plate and the upper cover plate are welded to form a second vapor chamber. And a lower cover plate of the first vapor chamber is in contact with a heat source. Through cooperation of the first vapor chamber and the second vapor chamber, the heat deposition phenomenon is reduced, and it is ensured that an electronic device is always in an excellent heat dissipation working condition.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a vapor chamber with upper and lower double heat dissipation modules. Background technique [0002] In recent years, with the rapid development of electronic information technology-related industries, various highly integrated and high-power electronic devices have been continuously applied to smart devices such as mobile phones and tablets. At the same time, in order to ensure the stable working conditions of the equipment, ensure The performance of the equipment has higher and higher requirements for the heat dissipation module. The vapor chamber is a heat dissipation device widely used in mobile phones and tablets. It has the advantages of good heat dissipation effect and strong product adaptability. [0003] The traditional vapor chamber usually includes a copper upper cover and a lower cover. The upper cover and the upper cover are welded and closed to form a vacuu...

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Problems solved by technology

[0006] 2. The capillary structure of the traditional vapor chamber is generally a very thin capillary copper mesh. The pores of each part of this capillary copper mesh are uniform, that is to say, the capillary adsorption force of each position of the whole capillary copper mesh is roughly the same. Under normal usage conditions, this kind of capillary copper mesh can basically meet the usage requirements.

However, due to the small size of the vapor chamber, the contact area between the upper cover and the heat dissipation backplane is limited. When the equipment is running at high power and high frequency, the small contact area between the upper cover and the heat dissipation backplane cannot guarantee the heat The rapid transfer of heat will lead to local heat dissipation on the heat dissipation backplane, causing local heating of the equipment, and also affecting the condensation of the working medium in the vapor chamber on the upper cover, resulting in a vicious circle of heat dissipation

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