Four-bit and eight-bit test socket compatible device
A technology of test socket and test platform, which is applied in the direction of measuring device shell, electronic circuit test, etc., can solve the problems of waste of resources, failure to keep up with demand, waste of equipment capacity, etc.
Pending Publication Date: 2022-04-29
GUANGDONG CHIPPACKING TECH
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Problems solved by technology
Most of the existing test models can only test OS products and cannot be installed with test boards. The start-up rate is 61.5%, resulting in a waste of equipment capacity. At the same time, the existing FT test capacity cannot keep up with demand, resulting in a waste of resources. Therefore, in order to To solve the above problems, it is urgent to design a 4-bit and 8-bit test socket compatible device
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[0054] The present invention will be further described below in conjunction with the accompanying drawings.
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Abstract
The invention discloses a 4-bit and 8-bit test seat compatible device, which comprises a test seat, an L-shaped support and a fixed seat, the test seat is connected with any one of the L-shaped support and the fixed seat, the L-shaped support is detachably connected to the side end of the test seat, and the fixed seat is detachably connected to the top end of the test seat. The L-shaped support is arranged at the side end of the testing seat, the horizontal position of the testing seat is adjusted through the L-shaped support, four-station simultaneous testing of a testing board card is achieved, the L-shaped support is replaced with an original fixing seat, eight-station simultaneous testing of an OS product is achieved, operation is simple, four-station and eight-station compatible testing is effectively achieved, the utilization rate of the testing platform is optimized, the testing capacity is improved, and the testing efficiency is improved. The equipment use cost is reduced, and resource waste is reduced.
Description
technical field [0001] The invention relates to the technical field of semiconductor testing, in particular to a 4-bit and 8-bit test socket compatible device. Background technique [0002] From the idea of a semiconductor chip to the final product that can be delivered to customers, it generally includes steps such as chip design, chip production, chip packaging, and chip testing. As an indispensable part of the semiconductor industry chain, semiconductor testing continues to increase in scale and complexity as the process continues to decline, and its importance in the project is also increasing. To some extent, it determines the product performance. Whether mass production and delivery to customers on time. After semiconductor packaging, FT (final test) testing is usually required. Before leaving the factory, faulty chips are screened out with the minimum time cost. The test data results are also used in process monitoring and optimization and product design optimizati...
Claims
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IPC IPC(8): G01R31/28G01R1/04
CPCG01R31/2851G01R31/2886G01R1/04
Inventor 陆建学孙林饶锡林易炳川黄乙为冯建柏梅俊杰
Owner GUANGDONG CHIPPACKING TECH
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