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Wafer grinding method

A grinding and wafer technology, applied in the direction of grinding drive devices, grinding machine parts, grinding/polishing equipment, etc., can solve problems such as adverse effects of devices, achieve the effect of small damage layer and shorten grinding time

Pending Publication Date: 2022-05-03
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the damaged layer will adversely affect the devices formed on the opposite side of the ground surface of the wafer, so it is desired to reduce the damaged layer of the wafer after grinding.

Method used

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Embodiment Construction

[0016] figure 1 The shown grinding device 1 is a device for grinding the wafer 80 sucked and held by the holding surface 302 of the chuck table 30 through the grinding unit 16. The front (- Y direction side) is a loading and unloading area for loading and unloading the wafer 80 with respect to the chuck table 30, and the rear (+Y direction side) on the device base 10 is held on the chuck table 30 by the grinding unit 16. The processing area of ​​the grinding processing of the wafer 80 .

[0017] In addition, the grinding device used in the grinding method of the wafer 80 of the present invention is not limited to the grinding device 1 such that the grinding unit 16 is a single-axis grinding device, and may also have a rough grinding unit and a fine grinding unit. A grinding unit and a biaxial grinding device capable of positioning the wafer 80 below the rough grinding unit or the finish grinding unit by using a rotating turntable, or the like.

[0018] figure 1 The wafer 80...

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Abstract

The invention provides a method for grinding a wafer, which can shorten grinding time and reduce a damaged layer of the ground wafer when the wafer is ground. The wafer grinding method includes the following steps: holding a wafer on a holding surface of a chuck table; a first grinding step of grinding the wafer to a thickness that does not reach a predetermined finished thickness of the wafer by controlling the grinding feed mechanism by the control unit so as to give a strong or weak load value to the load value measured by the load measurement unit; and a second grinding step of, after the first grinding step, applying a preset set load value and grinding the wafer to a predetermined finished thickness by using the grinding tool.

Description

technical field [0001] The present invention relates to a wafer grinding method for grinding workpieces such as semiconductor wafers. Background technique [0002] For example, a grinding apparatus for grinding a wafer held on a holding surface of a chuck table with a grinding wheel disclosed in Patent Document 1 below presses the grinding wheel against the wafer to perform grinding. In addition, when the grinding speed at which the grinding stone approaches the wafer is increased, the force pressing the grinding stone against the wafer increases, so that the grinding time can be shortened. [0003] However, since the force pressing the grinding wheel against the wafer is large, a damaged layer in which cracks are formed in layers in the depth direction from the surface to be ground of the wafer is formed. In addition, for example, when grinding a wafer made of a hard material such as sapphire, the grinding wheel may be reciprocated up and down as disclosed in Patent Docume...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/10B24B37/005B24B37/30B24B37/34B24B47/20H01L21/304
CPCB24B37/042B24B37/107B24B37/005B24B37/30B24B37/34B24B47/20H01L21/304B24B7/228B24B49/16H01L21/67092H01L21/67253B24B7/241
Inventor 久保徹雄中山英和
Owner DISCO CORP