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530results about How to "Shorten grinding time" patented technology

Silicon carbide wafer bevel grinding, milling and polishing machine and operation method thereof

The invention discloses a silicon carbide wafer bevel grinding, milling and polishing machine and an operation method thereof. The silicon carbide wafer bevel grinding, milling and polishing machine comprises a supporting sheet (1), a rotating shaft (2), a driving motor (3), a motor bracket (4), a vertical rotating arm (5), a horizontal rotating arm (6), a slide frame (7) and a screw rod (9) which are sequentially connected, wherein the lower end of the screw rod (9) is sequentially connected with a first cone gear (12), a second cone gear (13), an adjusting shaft (14) and a rotating wheel (15); a machining tool (19) of a silicon carbide wafer is arranged below the supporting sheet (1). The silicon carbide wafer bevel grinding, milling and polishing machine is reasonable in structural design, convenient to operate and high in working efficiency, bevel grinding, milling and polishing integrated machining can be performed on the silicon carbide wafer, the working efficiency is high, the roughness of a polished bevel can be smaller than 0.1 micron, the machining precision is high, and the applicability is high. The operation method can be applied to the bevel grinding, milling and polishing integrated machining on the silicon carbide wafer which is round or not round.
Owner:山东粤海金半导体科技有限公司

Cavity type film bulk acoustic resonator and preparation method thereof

InactiveCN107528561AReduce the thermal steady state temperatureHigh hardnessImpedence networksSteady state temperatureAmorphous silicon
The invention relates to a cavity type film bulk acoustic resonator, comprising a substrate, an isolation layer, a support layer, a bottom electrode layer, a piezoelectric layer and a top electrode layer that are sequentially arranged from bottom to top, wherein the middle part of the upper surface of the isolation layer is recessed downwards to form a groove, the groove is sealed by the support layer and the substrate to form a sealed cavity, the height of the lower surface of the sealed cavity is less than the height of the upper surface of the substrate, the lower surface of the sealed cavity is a flat surface, and the material of the support layer is SiC. And meanwhile, the invention also discloses a preparation method of the acoustic resonator. According to the cavity type film bulk acoustic resonator and the preparation method thereof disclosed by the invention, the structure of the device is stabilized by the SiC support layer, and the power capacity can be improved; the heat can be effectively dissipated, the thermal steady-state temperature of the device can be reduced, and good thermal stability can be achieved; and according to the method, amorphous silicon layers are removed by using an acetone solution lift-off process, a CMP process can be simplified, the grinding time can be reduced, the grinding uniformity can be improved, and the frequency stability and the rate of finished products of the device can be improved.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Milling cutter provided with equidistant arc head on eccentric shape flank surface and grinding method

The present invention relates to a milling cutter provided with an equidistant arc head on an eccentric shape flank surface and a grinding method, the cutter can reduce the vibration during the process of processing of different hardness of hardened steels for splicing of a mould, the cutter life and workpiece surface quality can be improved, the flank surface shape can be changed, and the cutter tip strength can be improved. The milling cutter is an overall hard alloy end milling cutter. The milling cutter includes a cutter shank (1) and the arc head (2), the arc head includes a large curvature arc (2-1) and a small curvature arc (2-2). Tooth-spacing angles are 87 degrees, 93 degrees, 87 degrees, and 93 degrees, tooth-spacing vertical angles are equal, helix angle (r) is 38 degrees, helix angle (v) is 40 degrees, and cutter end cutting edge flank surface (10) and circumferential cutting edge (6) are in eccentric shape. Front angle is in the range of 0-3 degrees, first clearance angle is in the range of 8-10 degrees, and second clearance angle is in the range of 15-22 degrees. The center position of the cutter is provided with cooling channels (3), the number of the cooling channels is four, and the four cooling channels respectively are located four cutting edge end tooth chip pockets. The present invention also provides a reference for the grinding of the cutter of the type.
Owner:HARBIN UNIV OF SCI & TECH

Method for preparing octenyl succinic acid modified starch and application thereof

The invention belongs to the technical field of preparation of starch, belongs to the technical field of preparation of modified starch, and in particular relates to a method for preparing octenyl succinic acid modified starch and application thereof. The method comprises the following steps of: drying the starch serving as a raw material and performing constant weight of the starch to reach a certain water content; grinding the starch to obtain activated starch; adding distilled water into the starch to oscillate and adding alkali to regulate pH; slowly adding octenyl succinic acid (OSA) into the starch; adding acid to neutralize after the reaction is finished; performing alcohol washing on the mixture; centrifugally collecting wet starch; drying the wet starch; pulverizing the wet starch; and screening to obtain the octenyl succinic acid modified starch. The method is characterized in that the raw material starch is mechanically activated before esterification reaction is carried out; and the reaction activity of the starch is increased, the substitution degree of the OSA is increased, the reaction time is shortened, the using amount of the alkali is reduced, and the production of the octenyl succinic acid modified starch is facilitated in a ball milling mode. The method can be used for food, such as starch glue, microcapsule wall materials, yoghourt, steamed sponge cakes, cakes and the like.
Owner:HUAZHONG AGRI UNIV

Super-junction semiconductor device with groove-type terminal structure

The invention discloses a super-junction semiconductor device with a groove-type terminal structure. The super-junction semiconductor device comprises a semiconductor substrate, a first electrode, a semiconductor region, an active device, a base region, a source region, an insulation control electrode, a passivation insulating layer, a plurality of second grooves and a second electrode, wherein the semiconductor region comprises an active region and a terminal region; the active device is formed in the active region and comprises a plurality of first grooves arranged at equal intervals; the plurality of second grooves are formed in the terminal region; a semiconductor material with a second conductive type is filled in the first grooves and the second grooves; the second electrode is continuously coated on the passivation insulating layer and the second grooves; the surfaces of the second grooves are in a ring shape and encircle the active region, the corners of the annular second grooves are in an arc shape, and the other parts are in a straight line shape; and the width of the corners is not equal to that of straight line. By the super junction semiconductor device, a super-junction terminal structure can be optimized, and the epitaxial growth cost is reduced.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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