This invention relates to the field of
organosilicon resin preparation technology, specifically to a method for synthesizing a high-performance
moisture-curing
organosilicon resin and its application. The preparation steps of the
organosilicon resin are as follows: Step 1, adding an
epoxy monomer and 2-vinylpyridine to a
solvent, then adding an initiator to obtain a mixture; Step 2, adding the organosilicon
monomer to the
solvent, adding a composite catalyst, and stirring to react, obtaining an organosilicon
prepolymer; Step 3, at
room temperature, adding a modified filler to the mixture, stirring to react under
inert gas protection, then adding the organosilicon
prepolymer, copolymerizing, and distilling under reduced pressure to obtain the organosilicon resin. The prepared organosilicon resin exhibits excellent mechanical properties, high tensile strength, large elongation at break, excellent tear strength, water impermeability, good
bonding strength, and high curing efficiency, with short surface
drying and hard
drying times. It possesses both
mechanical strength and flexibility, as well as reliable
waterproofing and adhesion.