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Method for manufacturing semiconductor packaging structure and clamping device

A technology of clamping equipment and packaging structure, which is applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve problems such as displacement, vibration, and molded wafers that cannot be leveled by chucks.

Pending Publication Date: 2022-05-06
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, warped molded wafers cannot be flattened by the chuck
Additionally, warped molded wafers may shift and vibrate during flattening
Therefore, it is difficult to perform subsequent steps on warped and thinned molded wafers

Method used

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  • Method for manufacturing semiconductor packaging structure and clamping device
  • Method for manufacturing semiconductor packaging structure and clamping device
  • Method for manufacturing semiconductor packaging structure and clamping device

Examples

Experimental program
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Embodiment Construction

[0028] Common reference numbers are used throughout the drawings and detailed description to refer to the same or similar components. Embodiments of the present disclosure will be more easily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to illustrate certain aspects of the disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first feature and the second feature are formed or disposed in direct contact, and may also include that additional features may An embodiment formed or disposed between a first feature and a second feature su...

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PUM

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Abstract

The invention relates to a method for manufacturing a semiconductor packaging structure and a clamping device. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; (b) transversely moving a pressing tool above the packaging body; and (c) pressing the packaging main body on the chuck through the pressing tool.

Description

technical field [0001] The present disclosure relates to a method and a clamping device for manufacturing a semiconductor package structure, and to a method including pressing and suction steps and a clamping device for implementing the method. Background technique [0002] In order to reduce the thickness of a semiconductor package structure, a molded wafer in an intermediate state of manufacture is thinned. However, a molded wafer may include a semiconductor die and a molding compound covering the semiconductor die. Thinned molded wafers may have severe warpage due to a coefficient of thermal expansion (CTE) mismatch between the semiconductor die and the molding compound. When a warped molded wafer is placed on a chuck for flattening, since the distance between the chuck and the warped molded wafer is too large, it is difficult A negative pressure or vacuum is established between the wafers. That is, warped molded wafers cannot be leveled by the chuck. Additionally, wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/68714H01L21/67121H01L21/6838H01L21/68728H01L21/68721H01L21/68785H01L21/67288H01L23/562H01L21/56H01L23/3128H01L21/687H01L21/6835H01L2221/68354H01L21/304H01L21/67092
Inventor 洪蘊笛
Owner ADVANCED SEMICON ENG INC