Thermosiphon radiator

A heat sink and thermosiphon technology, applied in cooling/ventilation/heating transformation, modification with liquid cooling, electrical components, etc., can solve problems such as inability to achieve heat dissipation

Pending Publication Date: 2022-05-06
SHENZHEN ENVICOOL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Based on this, it is necessary to address the above problems and propose a thermosiphon radiator to solve the problem that the thermosiphon radiator in the prior art cannot achieve a good heat dissipation effect when dissipating heat from multiple heat sources with different heights and deviated from the horizontal direction. technical problem

Method used

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Embodiment Construction

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purpos...

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Abstract

The thermosyphon radiator comprises a base plate and a radiating fin assembly, the base plate is at least provided with a first containing cavity, a second containing cavity and a first plate face, and the first plate face is at least provided with a first radiating station and a second radiating station; the radiating fin assembly at least comprises a first radiating fin with a first gas-liquid channel and a second radiating fin with a second gas-liquid channel, the projection of the first gas-liquid channel is at least partially overlapped with the first accommodating cavity, and the projection of the second gas-liquid channel is at least partially overlapped with the second accommodating cavity and partially overlapped with the first accommodating cavity; in the vertical direction of the base plate, the first containing cavity and the first gas-liquid channel are arranged in a staggered mode, the first gas-liquid channel is located on the upper side of the first containing cavity, the second containing cavity and the second gas-liquid channel are arranged in a staggered mode, and the second gas-liquid channel is located on the upper side of the second containing cavity. Therefore, the technical problem that a good heat dissipation effect cannot be achieved when a thermosiphon radiator dissipates heat of a plurality of heat sources which are different in height and deviate from the horizontal direction is solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a thermosiphon radiator. Background technique [0002] In the past ten years, with the rapid development of communication equipment, supercomputing, data mining, e-commerce, artificial intelligence and other fields, the demand for total heat dissipation has increased sharply. Device miniaturization further increases power density, while also exacerbating the need for efficient cooling solutions. [0003] In the prior art, components with high heat flux density can be dissipated by means of thermosiphon radiators. When multiple heat sources with different heights deviate from the horizontal direction, especially when the heat sources are placed vertically, good heat dissipation cannot be achieved when dissipating multiple heat sources with different heights and deviated from the horizontal direction through the existing thermosiphon radiator effect, which in turn will a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336H05K7/20318H05K7/20309H05K7/2029H05K7/20409
Inventor 王烨韦立川
Owner SHENZHEN ENVICOOL TECH
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