Chip base ceramic local metallization device and process

Abstract

The invention provides a chip base ceramic local metallization device and process, and relates to the technical field of chip base processing, the chip base ceramic local metallization device comprises moving parts, the moving parts are rectangular structures, the moving parts are made of metal aluminum materials, the bottom of each moving part is provided with uniformly arranged through grooves, each through groove is of an L-shaped structure, and the included angle position of the outer side of the top end of each through groove is of an arc-shaped structure. When the device is used, the moving part can be stressed to clamp the base, and due to the fact that the moving part is made of metal aluminum and can conduct heat rapidly, when the base is heated, the moving part can conduct auxiliary heating on the side edge of the base, heat can heat the side edge and the top end of the base at the same time, the heating effect is better, and heating is faster and more convenient. The metallization material can be melted more rapidly, and the problems that a ceramic local metallization device is prone to influencing the heating efficiency, heat is slowly transferred to the position above the base, and an auxiliary heat conduction structure is lacked are solved.

Description

technical field [0001] The invention relates to the technical field of chip base processing, in particular to a chip base ceramic partial metallization device and process. Background technique [0002] When processing the ceramic chip base, it is usually necessary to perform local metallization operations. Ceramic metallization is to firmly adhere a layer of metal film on the surface of the ceramic to realize the welding between the ceramic and the metal; [0003] However, as far as the current traditional ceramic partial metallization device is concerned, in the process of use, when the components are running, it is easy to generate vibration, which easily leads to the displacement of the device, which in turn leads to inaccurate metallization, and lacks an auxiliary limit fixing structure. When the base is fixed, it is easy to affect the heating efficiency, so that the heat is transferred to the top of the base slowly, and the lack of auxiliary heat conduction structure, w...

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Problems solved by technology

[0003] However, as far as the current traditional ceramic partial metallization device is concerned, in the process of use, when the components are running, it is easy to generate vibration, which easily leads to the displacement of the device, which in turn leads to inaccurate metallization, and lacks an auxiliary limit fixing structure. When the base is fixed, it is easy to affect the heating efficiency, so that the heat is transferred to the top of the base slowly, and there is no auxiliary heat conduction structure. When the base needs to be removed, it is easy to cause the operation and pulling structure to heat up, and it is easy to burn the staff.

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