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System and method for automatically acquiring position of to-be-processed material in laser processing

A laser processing and automatic acquisition technology, applied in the field of position systems, can solve the problem that the laser module cannot automatically identify the processing materials, and achieve the effect of simplifying the operation process and facilitating use

Pending Publication Date: 2022-05-24
深圳快造科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The laser module cannot automatically identify the position of the processed material

Method used

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  • System and method for automatically acquiring position of to-be-processed material in laser processing
  • System and method for automatically acquiring position of to-be-processed material in laser processing

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Embodiment Construction

[0029] In the following description of the drawings and specific embodiments, details of one or more embodiments of the present invention will be described. From these descriptions, drawings, and claims, other features, objects, and advantages of the present invention are clear.

[0030]It should be understood that the embodiments illustrated and described in the application are not limited to the details of the construction and arrangement of the components illustrated in the following description or illustrated in the drawings. The illustrated embodiments may be other embodiments, and can be implemented or executed in various ways. Each example is provided by means of an interpretation of the disclosed embodiment rather than a limitation. In fact, those skilled in the art will be apparent that, without departing from the scope or substance of disclosure of the present invention, various modifications and variants may be made to various embodiments of the present invention. For e...

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Abstract

The invention relates to a method for automatically acquiring the position of a to-be-processed material for laser processing equipment, and the laser processing equipment is provided with a laser module for processing the to-be-processed material and a working platform for placing the to-be-processed material. The method comprises the following steps: establishing a first mapping relation between xy coordinates of points on a working platform and xy motion coordinates of a laser module; establishing a second mapping relation between a point on the to-be-processed material placed on the working platform and the xy motion coordinate of the laser module; and based on the second mapping relation, the laser processing equipment obtains the position of the to-be-processed material.

Description

Technical field [0001] The present invention relates to the field of laser processing, more particularly to a system and method for automatically obtaining the location of the material to be processed for laser processing. Background [0002] Traditional three-dimensional automation equipment (such as traditional three-dimensional printing devices, laser engraving devices, CNC, etc.) is more difficult to operate and less intelligent, so it limits its application scope. Desktop-level or consumer-grade 3D automation devices can meet the daily DIY needs of users, which is fun and entertaining. But less intelligent 3D automation devices limit user use. When 3D automation equipment is used for laser processing, the user needs to place the material to be processed on the working platform. For traditional 3D automation equipment, the user needs to place the material to be processed in a defined position, usually in the center of the work platform. The laser module cannot automatically i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/70B23K26/03
CPCB23K26/00B23K26/70B23K26/032Y02P90/02
Inventor 郑志鹏钟忠朋陈学栋
Owner 深圳快造科技有限公司