Defective welding spot density analysis system of solder paste detector and method thereof
A technology of bad solder joints and analysis system, which is applied in the fields of analysis materials, image analysis, general control systems, etc., can solve the problems of inconvenient circuit board inspection and maintenance, bad solder joint density analysis system
Pending Publication Date: 2022-05-27
INVENTEC PUDONG TECH CORPOARTION +1
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[0005] In view of the problem in the prior art that it is inconvenient to detect and repair unqualified circuit boards immediately detected and judged by solder paste detectors, the present invention discloses a bad solder joint density analysis system and method for solder paste detectors, wherein:
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[0065] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings and examples, so as to fully understand and implement the implementation process of how the present invention applies technical means to solve technical problems and achieve technical effects.
[0066] The following first describes the bad solder joint density analysis system of the solder paste inspection machine disclosed in the present invention, and please refer to figure 1 shown, figure 1 It is a system block diagram of the bad solder joint density analysis system of the solder paste inspection machine of the present invention.
[0067]In the system for analyzing the density of bad solder joints of the solder paste inspection machine disclosed in the present invention, the solder paste inspection machine (SolderPaste Inspection, SPI) 10 performs real-time inspection after the soldering of the circuit board is set to generate a inspection log, and t...
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The invention discloses a bad welding spot density analysis system and method of a solder paste detector, and the solder paste detector carries out the real-time detection after the solder paste detector carries out the soldering setting of a circuit board, so as to generate a detection log, and provides the detection log. Analyzing and judging bad welding spot information in the detection log to set clustering of the bad welding spot information so as to find out a bad welding spot area, and performing information statistics on the bad welding spot area so as to generate bad welding spot warning information and display the bad welding spot warning information. Therefore, the technical effect of providing convenience for analyzing poor welding spots of the circuit board so as to carry out accurate maintenance can be achieved.
Description
technical field [0001] The present invention relates to a density analysis system and a method thereof, in particular, to a method for analyzing the inspection log provided by a solder paste inspection machine to find out a bad solder joint area, and to perform the inspection according to the bad solder joint information in the bad solder joint area. A system for analyzing the density of bad solder joints of a solder paste inspection machine and a method thereof for generating warning information for bad solder joints by information statistics. Background technique [0002] The solder paste inspection machine is widely used in the surface assembly production line. The solder paste inspection machine further provides real-time inspection of the circuit board after the solder paste inspection machine solder setting, so as to check whether the solder setting of the circuit board is qualified for screening. [0003] In front of the solder paste inspection machine, the real-time ...
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IPC IPC(8): G01N21/956G06K9/62G06T7/00G06T7/62G06V10/762
CPCG01N21/95607G06T7/0008G06T7/62G01N2021/95646G01N2021/95615G06T2207/10004G06T2207/30152G06F18/23G05B19/41875G05B2219/37215G01N21/951
Inventor 王福利于莉
Owner INVENTEC PUDONG TECH CORPOARTION