Filling and sealing process for placing mounting plate in shell and only exposing contact pins

A technology for mounting boards and housings, which is applied in the fields of coating non-metallic protective layers, coatings, and printed circuit manufacturing. It can solve the problems of non-detachable modules and the inability to design the connection method of mounting boards and housing fasteners, and achieve easy operation. , high reliability, and strong practicability

Pending Publication Date: 2022-05-27
四川九洲空管科技有限责任公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned deficiencies in the prior art, the invention provides a potting process in which the mounting plate is placed in the shell and only the pins are exposed, which solves the requirement that the module cannot be disassembled after the mounting plate is potted, and plays a role of confidentiality, and because of Due to the limited space, it is impossible to design the connection between the mounting plate and the shell with fasteners

Method used

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  • Filling and sealing process for placing mounting plate in shell and only exposing contact pins
  • Filling and sealing process for placing mounting plate in shell and only exposing contact pins
  • Filling and sealing process for placing mounting plate in shell and only exposing contact pins

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Embodiment Construction

[0033] The specific embodiments of the present invention are described below so that those skilled in the art can understand the present invention, but it should be clear that the present invention is not limited to the scope of the specific embodiments. For those of ordinary skill in the art, as long as various changes Within the spirit and scope of the present invention defined and determined by the appended claims, these changes are obvious, and all inventions and creations using the concept of the present invention are included in the protection list.

[0034] The potting process provides a method for protecting the solder joints of the device, without designing the mounting holes of the printed board, and directly potting the printed board in the shell with only connecting pins exposed. Including device solder joint protection process, mounting board and shell potting process. The specific process flow is:

[0035] like figure 1 As shown, the first step is to clean and ...

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Abstract

The invention discloses a potting process for placing a mounting plate in a shell and only exposing a pin. According to the invention, an appropriate pouring sealant is selected, a reasonable pouring process is designed, the requirement that only the connecting pins are exposed when the mounting plate is poured in the shell is met, the mounting plate gives full play to the due functional performance, the module after pouring is not detachable, and a confidential effect is achieved. And the problem that the mounting plate and the shell cannot be connected through a fastener due to limited space can be solved, the mounting plate is directly encapsulated in the shell, only the connecting contact pins are exposed, and the requirements of impact resistance, vibration resistance and severe environment resistance are met. The encapsulation process is simple and convenient to operate, high in reliability and strong in practicability.

Description

technical field [0001] The invention relates to the technical field of potting technology, in particular to a potting technology in which a mounting plate is placed in a casing and only pins are exposed. Background technique [0002] With the improvement of the user's demand for product resistance to shock, vibration and harsh environments, and to protect the designed mounting plate from being recognized, and to allow the mounting plate to fully exert its due functional performance, the design proposes mounting plate potting Only the connection pins are required to be exposed in the housing. In order to improve the shock resistance, vibration resistance and harsh environment performance of the product, most of the installation board and the housing are connected by fasteners, and then the gap between the installation board and the housing is filled with potting materials. [0003] If the potting material is only one-component room temperature vulcanized silicone rubber, alt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28B29C45/14
CPCH05K3/284B29C45/14336B29C45/14639B29C2045/14459
Inventor 叶姗杨刚韩莉萍青丹
Owner 四川九洲空管科技有限责任公司
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