Laser cutting equipment and method

A laser cutting and equipment technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of slow cutting efficiency and increase the cost of laser cutting, and achieve the effect of fast and stable cutting

Inactive Publication Date: 2022-05-31
JIANGSU HUYUN LASER EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current laser cutting device can only cut some plates with uniform thickness. When cutting plates with uneven thickness, it is necessary to manually adjust the pulse width of the laser, which leads to slow cutting efficiency and increases the cost of laser cutting.

Method used

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  • Laser cutting equipment and method
  • Laser cutting equipment and method
  • Laser cutting equipment and method

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Embodiment Construction

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0031] In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present inventio...

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Abstract

The invention discloses laser cutting equipment and method, and relates to the technical field of laser cutting, the laser cutting equipment comprises a workbench, and the workbench is provided with a conveying device, a detecting assembly, a moving assembly, a cutting assembly, a pressing assembly and a control device. Through cooperation of the pressing assembly, the cutting assembly and the adjusting assembly, the laser emitting device arranged on the surface of the bearing plate is moved by a proper height, then the focus of the laser emitting device is adjusted, the cutting speed of the laser emitting device on the plate is adjusted, and therefore when the device is used for cutting the plate, the cutting efficiency is improved. And the laser cutting speed can be dynamically adjusted in real time according to the thickness of each area of the plate.

Description

technical field [0001] The present invention relates to the technical field of laser cutting, and more particularly, to a laser cutting equipment and method. Background technique [0002] Laser cutting is an advanced cutting method. It uses the extremely high energy density of the laser to quickly heat the material to be cut to the melting point or boiling point, so that the material is melted or vaporized, and then the melted or vaporized material is blown away by the coaxial high-pressure gas. , forming a slit to complete the cutting process. Laser cutting has the characteristics of fast cutting speed and strong flexible processing ability. In the actual processing process, a laser cutting machine can be used to easily cut and process parts and plates of different shapes and sizes. [0003] However, the current laser cutting device can only cut some plates with uniform thickness. When cutting plates with uneven thickness, the pulse width of the laser needs to be adjusted...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/04B23K26/046B23K26/70
CPCB23K26/38B23K26/04B23K26/046B23K26/70B23K26/702
Inventor 王世伟
Owner JIANGSU HUYUN LASER EQUIP CO LTD
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