Shielding cover shape design method capable of modulating cooling airflow form in narrow space

Abstract

A shielding case shape design method capable of modulating a narrow space cooling air flow form is characterized in that a parameterized level set assembly of a closed B-spline curve is utilized to describe the appearance topology of a shielding case, the shielding case is endowed with the capacity of arbitrary deformation, and the surface forced convection heat transfer performance of the shielding case is enhanced; a parameterized level set assembly of a hyperelliptic curve is used for describing a heating electronic component, and the electronic component is ensured to be always in the center of the shielding case in the optimization process through the same central position of the parameterized level set assembly and the hyperelliptic curve, so that the optimal position distribution of the electronic component on the PCB and the optimal shielding case appearance are optimized and designed at the same time; the optimization result can be directly and seamlessly connected with a CAD system, the post-processing process is greatly simplified, and meanwhile, parameterized boundary expression provides possibility for accurately controlling the structure size, overcoming manufacturing constraints and the like.

Description

technical field [0001] The invention belongs to the technical field of PCB chip shielding covers, and in particular relates to a shape design method for a shielding cover capable of modulating the cooling airflow shape in a narrow space. Background technique [0002] With the gradual improvement of people's living standards, the functional requirements for portable electronic devices are also gradually increasing, resulting in a linear increase in the number of power devices and heating power in portable electronic devices, which puts forward higher requirements for the spatial arrangement of devices on the PCB in the device; at the same time, The demand for thin and light equipment forces the continuous reduction of the volume and size of portable electronic equipment, and the space arrangement between electronic components on the PCB becomes more and more compact. Different electronic components are respectively equipped with shielding covers to shield the electromagnetic ...

AI Technical Summary

Problems solved by technology

[0003] In addition, according to Moore's Law, the number of diodes on electronic components is constantly doubling, and the heating power is constantly increasing. Although structures such as through holes can be provided on traditional shielding covers to enhance natural convection heat exchange between electronic components in the shielding cover and the outside world, there are limitations. Due to the low efficiency of natural convection heat transfer, the heat cannot be discharged in time, causing the temperature of electronic equipment to exceed the safe temperature of the device, resulting in a decrease in device reliability, and even serious safety accidents such as spontaneous combustion. The combination of traditional heat conduction, natural convection and radiation heat dissipation can no longer meet portable For the heat dissipation requirements of electronic equipment, more and more electronic equipment manufacturers are turning their attention to forced air cooling. The channel quickly flows through the surface of the shield, so that the heat of the components is quickly taken out of the equipment by forced convection, ensuring the safe operation of the electronic components in the shield; Thermal performance, but the existing shielding covers are often rectangular and other regular shapes, resulting in gap air ducts composed of different shielding covers are often quadrilateral and other shapes, and unreasonable shielding shapes will result in low surface convective heat transfer coefficients , cannot meet the heat dissipation requirements of heating electronic components. Not only that, the heat dissipation requirements of different power electronic components are not the same, and the unreasonable arrangement of components will seriously restrict the heat dissipation potential of the cooling air. Therefore, a reasonable arrangement of electronic components should be designed Form and shield shape are critical for reducing component temperature

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