Dehumidifying device and polishing equipment
An equipment and polishing head technology, applied in grinding/polishing equipment, grinding devices, metal processing equipment, etc., can solve the problems of reduced equipment efficiency, increased scrap rate, time-consuming and laborious, etc., to reduce scrap rate, avoid false alarms, The effect of improving accuracy
Pending Publication Date: 2022-07-01
ZING SEMICON CORP
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Problems solved by technology
[0005] However, during the polishing process, residual water in the moisturizing nozzle 11 on the polishing head 10 will splash onto the sensor 12. If the head 12a of the sensor 12 has water vapor accumulated into water droplets 14, a false alarm will be triggered, causing the corresponding polishing head 10 stops running, it is necessary to manually blow off the water on the sensor 12 with an air gun to remove the false alarm
Since the polishing head 10 is out of operation, the wafer 13 pressed under the polishing head 10 and on the polishing pad 15 needs to be removed and scrapped, the scrap rate increases, and the false alarm needs to be removed by manually blowing off the water on the sensor 12 with an air gun. Then the equipment is operated, which is time-consuming and labor-intensive, and the efficiency of the equipment is reduced.
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[0024] The dehumidifying device and polishing equipment of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and accompanying drawings. However, it should be noted that the concept of the technical solution of the present invention can be implemented in various forms, and is not limited to the specific implementation described here. example. The accompanying drawings are all in a very simplified form and in an inaccurate scale, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.
[0025] The terms "first," "second," etc. in the specification are used to distinguish between similar elements, and are not necessarily used to describe a particular order or temporal order. It is to be understood that the terms so used are intercha...
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The invention provides a dehumidification device and polishing equipment, the dehumidification device and a sensor used for wafer slip sheet detection are fixed on one side of a polishing head through a fixing block, the dehumidification device comprises a quick plug connector and an air blowing column, the air blowing column is vertically fixed in the fixing block, and the quick plug connector is connected with the air blowing column. One end of the air blowing column is connected with the quick plug connector to be communicated with dehumidification gas, the other end of the air blowing column is provided with a jet orifice, and the jet orifice jets gas towards the head of the sensor to form gas wall protection on the head of the sensor. The dehumidification device provided by the invention can effectively remove the liquid drops attached to the head of the sensor for wafer slip sheet detection, avoids false alarm caused by the liquid drops attached to the head of the sensor, improves the accuracy of slip sheet detection, reduces the rejection rate, and improves the operation efficiency of equipment.
Description
technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a dehumidification device and a polishing device. Background technique [0002] Semiconductor silicon wafers are the main substrate materials for the manufacture of ultra-large-scale integrated circuits. With the rapid development of the semiconductor industry, the requirements for the accuracy of substrate materials are getting higher and higher, especially for the outer surface of the wafer. The more stringent, generally, the outer surface of the wafer needs to be polished during substrate processing, so as to ensure that no defects such as slip lines or epitaxial stacking faults are generated at the edge of the epitaxial wafer, thereby improving the performance of epitaxial wafers or devices. Yield. [0003] The surface polishing of the wafer often needs to be completed by two polishing steps: double side polish (DSP, double side polish) and front ...
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Patent Timeline
Login to View More IPC IPC(8): B24B37/07B24B37/34B24B49/12
CPCB24B37/07B24B37/34B24B49/12
Inventor 王红磊吴凤良胡建平
Owner ZING SEMICON CORP