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Stripping mechanism and laminating device using same

A technology of peeling mechanism and peeling starting point, applied in the directions of lamination, layered products, lamination auxiliary operation, etc., can solve the problems of peeling film, difficult to form peeling starting point, etc., and achieve the effect of smooth peeling action

Pending Publication Date: 2022-07-01
NIKKISO COMPANY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the conventional peeling mechanism softens the entirety of the sheet with the film by heat treatment, it is difficult to peel the film from the sheet, that is, it is difficult to form a peeling starting point (hereinafter referred to as "difficult to form a peeling starting point"). department")

Method used

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  • Stripping mechanism and laminating device using same
  • Stripping mechanism and laminating device using same
  • Stripping mechanism and laminating device using same

Examples

Experimental program
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Effect test

Embodiment approach

[0125] The first embodiment of the present invention is a peeling mechanism 100 including a peeling stage 20 for placing a sheet Sf with a film in a fixed state, and a peeling head 10 for peeling the film f from the sheet S placed on the peeling stage 20 and a cooling device 11, which cools a part of the outer peripheral portion of the sheet Sf with a thin film to form a peeling starting point Ra; the peeling head 10 includes a film holding device 12, 14 that holds the peeling starting point Ra In the state of the film f, the film f is peeled off from the sheet S by the relative movement of the peeling head 10 and the peeling stage 20 .

[0126] As described above, by cooling a part of the outer peripheral portion of the sheet Sf with a thin film to form the peeling starting point portion Ra, the rigidity of each of the thin film f and the sheet S can be increased, and the integration of the thin film f and the sheet S can be suppressed. It is possible to solve the problem (di...

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Abstract

The present invention relates to a peeling mechanism and a laminating device using the peeling mechanism, which can smoothly perform a peeling action without damaging a sheet by easily forming a peeling starting point part, and a laminating device using the peeling mechanism. A peeling mechanism (100) is provided with: a peeling stage (20); a peeling head (10); and a cooling device (11) for cooling a part of the outer peripheral part of the sheet (Sf) with the thin film to form a peeling starting point part (Ra). The peeling head (10) includes film holding devices (12, 14) that peel the film (f) from the sheet (S) by relative movement of the peeling head (10) and the peeling stage (20) while holding the film (f) at the peeling starting point (Ra). Therefore, by easily forming the stripping starting point part, the stripping action can be smoothly performed without damaging the sheet.

Description

technical field [0001] In particular, the present invention relates to a peeling mechanism provided with a cooling device and a lamination apparatus using the peeling mechanism. Background technique [0002] The stacking device stacks a plurality of sheets constituting electronic components, and includes a peeling mechanism, an alignment device, a stacking device, a conveying device, and the like. This peeling mechanism peels off the film from the uppermost sheet before aligning the sheets by the alignment device, or after forming a laminate composed of a plurality of sheets by the laminating device. [0003] For example, Patent Document 1 (in particular, refer to paragraphs [0052] to [0055] and Image 6 (a) part) describes a peeling mechanism (hereinafter referred to as "conventional peeling mechanism") which heat-processes the entire sheet with a thin film, and after the adhesive force is reduced by the foaming expansion of the adhesive layer, Peel the film from the sheet...

Claims

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Application Information

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IPC IPC(8): B32B38/10
CPCB32B38/10
Inventor 牧野由泽田智世
Owner NIKKISO COMPANY
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