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Thermal printhead and method for manufacturing thermal printhead

A technology of thermal print head and heating part, which is applied in printing and other directions, can solve the problems of wiring layer damage and expansion, and achieve the effect of preventing damage

Pending Publication Date: 2022-07-01
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the manufacture of this thermal print head, when the substrate is cut, if damage occurs at the peripheral edge of the main surface of the substrate, the damage may spread to the main surface due to the influence of the crystal structure of the substrate.
This may cause damage to the wiring layer formed on the main surface of the substrate.

Method used

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  • Thermal printhead and method for manufacturing thermal printhead
  • Thermal printhead and method for manufacturing thermal printhead
  • Thermal printhead and method for manufacturing thermal printhead

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 〕

[0099] based on Figure 1 to Figure 7 , the thermal print head A10 according to the first embodiment of the present invention will be described. The thermal print head A10 constitutes a main part of a thermal printer B10 to be described later. The thermal print head A10 consists of a main part and an auxiliary part. The main part of the thermal print head A10 includes a substrate 1 , an insulating layer 2 , a resistor layer 3 , a wiring layer 4 and a protective layer 5 . The attached portion of the thermal print head A10 includes a wiring substrate 71 , a heat dissipation member 72 , a plurality of driving elements 73 , a plurality of first wires 74 , a plurality of second wires 75 , a sealing resin 76 , and a connector 77 . here, in figure 1 In the above, for the convenience of understanding, the protective layer 5 is seen through, and the illustration of the plurality of first wires 74 , the plurality of second wires 75 and the sealing resin 76 is omitted. exist figur...

no. 2 approach 〕

[0163] based on Figure 24 to Figure 27 , the thermal print head A20 according to the second embodiment of the present invention will be described. In these figures, the same reference numerals are given to the same or similar elements as those of the thermal print head A10 described above, and repeated descriptions are omitted. here, Figure 24 For ease of understanding, the protective layer 5 is seen through.

[0164] In the thermal print head A20, the structure of the substrate 1 is different from that of the thermal print head A10 described earlier.

[0165] like Figure 24 As shown, the first end surface 13 of the substrate 1 includes a first region 131 and a second region 132 . The first region 131 is connected to the first edge 11A of the main surface 11 of the substrate 1 . The second area 132 is connected to the second edge 11B of the main surface 11 and the first area 131 . And the second end surface 14 of the substrate 1 includes a third area 141 and a fourth ...

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PUM

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Abstract

The invention provides a thermal printing head and a manufacturing method thereof, which can prevent damage of a wiring layer caused by damage of a substrate during manufacturing. A thermal print head (A10) includes: a substrate (1) having a main surface (11) and a back surface (12) facing opposite sides in a z direction, and a first end surface (13) connected to the main surface (11); a resistor layer (3) at least partially formed on the main surface (11) and including a plurality of heat generating sections (31) arranged in the main scanning direction; and a wiring layer (4) that is electrically connected to the plurality of heat generation units (31) and is formed in contact with the resistor layer (3). The first end surface (13) overlaps the rear surface (12) as viewed in the z-direction and is inclined with respect to the main surface (11) on the side where the rear surface (12) is located in the z-direction. The first end surface (13) is exposed from the resistor layer (3) and the wiring layer (4).

Description

technical field [0001] The present invention relates to a thermal print head and a method of manufacturing the same. Background technique [0002] Patent Document 1 discloses a thermal print head having a substrate formed of a material containing silicon (Silicon). The substrate of this thermal print head has a main surface, and a convex portion extending in the main scanning direction and protruding from the main surface. As in Patent Document 1 Image 6 etc., a plurality of heat generating parts are arranged in the main scanning direction on the convex part. According to such a configuration, since the printing medium can be reliably brought into contact with the convex portion on which the plurality of heat generating portions are arranged, improvement of the printing quality can be expected. In addition, the substrate of the thermal print head has the advantages of relatively high thermal conductivity and low cost compared with the substrate formed of a material contai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/335
CPCB41J2/33505B41J2/33535B41J2/3359
Inventor 仲谷吾郎
Owner ROHM CO LTD