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Automatic heat dissipation verification platform and verification method

A verification platform and heat dissipation module technology, which is applied in the directions of instruments, calculations, electrical digital data processing, etc., can solve the problems of high cost and long time consumption, achieve high verification accuracy, reduce design costs, and save research and development time.

Active Publication Date: 2022-07-01
P&R MEASUREMENT INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In order to solve the problems of high cost and long time consumption in the prior art for determining the pressure of the heat dissipation module on the CPU and other heat dissipation parameters, the present invention provides an automatic Thermal verification platform and verification method

Method used

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  • Automatic heat dissipation verification platform and verification method
  • Automatic heat dissipation verification platform and verification method

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Embodiment Construction

[0051] The technical solutions of the present invention will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are not all embodiments of the present invention, and all other The embodiments all belong to the protection scope of the present invention. It should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", etc. are based on the orientations shown in the drawings or The positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0052] like figure 1 As shown, the present invention provides an automated heat dissipation ...

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Abstract

The invention relates to the technical field of heat dissipation verification, in particular to an automatic heat dissipation verification platform and a verification method.The automatic heat dissipation verification platform comprises a test module and a control module, and the test module comprises a driving air cylinder module, an upper fixing module, a pressing plate module, a carrier plate module and a support; the upper fixing module is arranged on the support, the driving air cylinder module is arranged on the upper fixing module, the driving air cylinder module is connected with the pressing plate module, and the pressing plate module comprises a heat dissipation module and a fan; the carrier plate module comprises a heat source plate, the heat source plate is in contact with the heat dissipation module, and a temperature sensor is arranged in the heat source plate; the control module controls the pressure of the air cylinder on the pressing plate module, the rotating speed of the fan and the power of the heat source plate. According to the invention, the pressure intensity of the heat source plate can be adjusted without repeatedly disassembling and assembling parts and arranging various springs, full-automatic parameter adjustment is realized by means of an internal program, a reasonable heat dissipation module verification result and heat dissipation parameters are formed, the design cost is reduced, and the research and development time is saved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation verification, in particular to an automated heat dissipation verification platform and a verification method. Background technique [0002] With the rapid development of electronic product technology and people's increasing requirements for the process efficiency and yield of electronic products, the electronic industry has gradually strengthened the development and optimization of product functional testing equipment while improving the process efficiency of electronic products. Among them, for high-power motherboard CPUs, especially high-power electronic products with a full-load working power exceeding 120W, the heat generated during operation is large, and corresponding cooling modules need to be designed. Since heat dissipation is very important for the service life of electronic products, The design of cooling modules corresponding to such electronic products has always been a techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/206Y02D10/00
Inventor 莫宗杰莫荣键王飞陈播田海翔
Owner P&R MEASUREMENT INC
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