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Packaging device and manufacturing method thereof

A technology for packaging devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as poor electromagnetic shielding effect, and achieve the effect of improving electromagnetic shielding effect

Pending Publication Date: 2022-07-08
NINGBO CHIPEX SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This application proposes a packaging device and a manufacturing method of the packaging device, which can at least solve the technical problem of poor electromagnetic shielding effect of the existing packaging device

Method used

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  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof

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Embodiment Construction

[0036] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures denote elements that have the same or similar functions. While various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0037] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

[0038] In addition, in order to better illustrate the present application, numerous specific details are given in the following detailed description. It should be understood by those skilled in the art that the present application may be practiced without certain specific details. In some instances, methods, means, compone...

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PUM

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Abstract

The invention provides a packaging device and a manufacturing method of the packaging device. The packaging device comprises a substrate, the substrate is provided with a grounding piece, the first side of the substrate is provided with a bonding pad, and the first end of the grounding piece is connected with the bonding pad; the chip is arranged on the second side of the substrate; and the shielding layer is arranged on the second side of the substrate, the shielding layer covers the chip, and the shielding layer is connected with the second end of the grounding piece. In the application, the substrate is provided with the grounding piece, the grounding piece can be made of metal, the first end of the grounding piece is connected with the bonding pad of the substrate, and the second end of the grounding piece is connected with the shielding layer, so that the shielding layer can be connected to the bonding pad through the grounding piece; in the practical application of the packaging device, the shielding layer can be grounded through the grounding piece bonding pad, and the electromagnetic shielding effect of the shielding layer is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a packaging device and a manufacturing method of the packaging device. Background technique [0002] The role of electromagnetic shielding is to cut off the propagation path of electromagnetic waves, thereby eliminating interference. Products packaged using the Land Grid Array (LGA) technology have poor electromagnetic shielding effect, resulting in the problem of mutual interference between devices. SUMMARY OF THE INVENTION [0003] The present application proposes a packaged device and a manufacturing method of the packaged device, which can at least solve the technical problem that the electromagnetic shielding effect of the existing packaged device is poor. [0004] According to an aspect of the present application, a packaged device is provided, characterized by comprising: [0005] a substrate, the substrate is provided with a grounding member, a ...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L23/31H01L21/50H01L21/56
CPCH01L23/552H01L23/3107H01L23/3135H01L21/50H01L21/56
Inventor 汪洋彭祎高局何肇阳
Owner NINGBO CHIPEX SEMICON