Supercharge Your Innovation With Domain-Expert AI Agents!

Packaging device and manufacturing method thereof

A technology for packaging devices and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as poor electromagnetic shielding effect, and achieve the effect of improving electromagnetic shielding effect

Pending Publication Date: 2022-07-08
NINGBO CHIPEX SEMICON
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] This application proposes a packaging device and a manufacturing method of the packaging device, which can at least solve the technical problem of poor electromagnetic shielding effect of the existing packaging device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof
  • Packaging device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numbers in the figures denote elements that have the same or similar functions. While various aspects of the embodiments are shown in the drawings, the drawings are not necessarily drawn to scale unless otherwise indicated.

[0037] The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

[0038] In addition, in order to better illustrate the present application, numerous specific details are given in the following detailed description. It should be understood by those skilled in the art that the present application may be practiced without certain specific details. In some instances, methods, means, compone...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a packaging device and a manufacturing method of the packaging device. The packaging device comprises a substrate, the substrate is provided with a grounding piece, the first side of the substrate is provided with a bonding pad, and the first end of the grounding piece is connected with the bonding pad; the chip is arranged on the second side of the substrate; and the shielding layer is arranged on the second side of the substrate, the shielding layer covers the chip, and the shielding layer is connected with the second end of the grounding piece. In the application, the substrate is provided with the grounding piece, the grounding piece can be made of metal, the first end of the grounding piece is connected with the bonding pad of the substrate, and the second end of the grounding piece is connected with the shielding layer, so that the shielding layer can be connected to the bonding pad through the grounding piece; in the practical application of the packaging device, the shielding layer can be grounded through the grounding piece bonding pad, and the electromagnetic shielding effect of the shielding layer is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a packaging device and a manufacturing method of the packaging device. Background technique [0002] The role of electromagnetic shielding is to cut off the propagation path of electromagnetic waves, thereby eliminating interference. Products packaged using the Land Grid Array (LGA) technology have poor electromagnetic shielding effect, resulting in the problem of mutual interference between devices. SUMMARY OF THE INVENTION [0003] The present application proposes a packaged device and a manufacturing method of the packaged device, which can at least solve the technical problem that the electromagnetic shielding effect of the existing packaged device is poor. [0004] According to an aspect of the present application, a packaged device is provided, characterized by comprising: [0005] a substrate, the substrate is provided with a grounding member, a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/552H01L23/31H01L21/50H01L21/56
CPCH01L23/552H01L23/3107H01L23/3135H01L21/50H01L21/56
Inventor 汪洋彭祎高局何肇阳
Owner NINGBO CHIPEX SEMICON
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com