Conductive treatment technology for insulating layer film surface
A technology of insulating film and processing technology, which is applied in the direction of metal material coating process, superimposed layer plating, coating, etc., can solve the problems of gas residue and cavity formation, and achieve firm adhesion, good exhaust performance, The effect of good electrical conductivity and electromagnetic shielding effect
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2019-02-15
Abstract
Description
technical field
[0001] The invention belongs to the technical field of electromagnetic shielding films, and in particular relates to a conductive treatment process for the surface of an insulating film. Background technique
[0002] With the rapid development of the modern electronics industry, a large number of electrical appliances and electronic equipment are widely used in industrial production and people's daily life, which promotes the development of industrial technology, improves people's lives, and improves people's quality of life. However, electrical appliances and electronic equipment will radiate a large amount of electromagnetic waves during use, and electromagnetic waves have caused non-negligible harm to the normal and safe operation of electronic equipment and the living environment of human beings. With the rapid increase in the number of various wireless communication systems and high-frequency electronic devices, electromagnetic interference phenomena and...
Examples
Embodiment 1
[0044] A conductive treatment method on the surface of an insulating film, comprising the following steps:
[0045] S11. Provide a base film with a thickness of 15 μm to 200 μm, uniformly coat a silicone-free release agent or silicone oil of 1 μm to 30 μm on the surface of the base film, cure with UV, and then bake and cure at 50 ° C to 180 ° C to form a release type Layered carrier film; evenly coat modified epoxy resin glue or high-temperature resistant ink with a thickness of 3 μm to 50 μm on the carrier film layer, and bake and cure at 50 ° C to 180 ° C to form an insulating layer.
[0046] S12. The vacuum plating pressure is 1×10 -2 Pa, the working vacuum plating pressure is 0.1~1Pa, the speed is 0.5~5m / min, the resistance value is ≤20Ω, the working voltage is 500~1000V, the working current is 230A, and the argon gas volume is 20~500SCCM. The insulating layer is pretreated in a manner.
[0047] S13. Place the insulating layer pretreated by vacuum plating in an alkaline ...